|
| | | 1 | 2 | 3 | 4 | 5 | | 6 | 7 | 8 | 9 | 10 | 11 | 12 | | 13 | 14 | 15 | 16 | 17 | 18 | 19 | | 20 | 21 | 22 | 23 | 24 | 25 | 26 | | 27 | 28 | 29 | 30 | 31 | | | |
|
|
应用点热传导要求高的芯片粘接（微处理器、功率半导体、超大规模集成电路。电压低适用于大芯片粘接）功率半导体芯片粘接、LED封装环氧体系，芯片粘接银胶;SOP,QFP,QFN溶剂型环氧芯片粘接胶，功率半导体，晶体极管。环氧体系，芯片粘接银胶SOP,QFP可粘接表面硅、银、金和铜silicon, silver, gold,Ni/Pd/Au leadframes and...
今天给大家介绍三款款导热灌封硅胶。导热分别为0.8；1；3.2主要用于电源模块灌封和小家电等灌封及其他电子元器件等的灌封详细的参数如下：应用点 电子电器灌封有机硅导热灌封胶电子电器灌封颜色Agray liquidgraypinkBwhite liquidblakewhiteMIXEDgray liquid lighter pink粘度cps@25cA4000-7000 4000B4000-700 ...
Thermally Conductive Resin for Use Witha Variety of HardenersDescription:Thermoset 340 is a very heavily filled epoxy resin formulated toprovide maximum thermal conductivity, excellent electricalinsulation, and outstanding mechanical properties. Thermoset340 resin offers a very low coeff ...
|
|
