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目录列表(原创):

│ ===FTPHOST_FILE_TREE===.txt        105.40 KB
│ ===ICCAE.COM免责说明===.txt        222 bytes
│ ===半导体仿真论坛简介===.txt        275 bytes
├─ebook        (0 folders, 29 files, 230.51 MB, 230.51 MB in total.)
│   ANSYS高级工程有限元分析范例精选_电子工程篇.rar        4.10 MB
│   [经典]ANSYS理论与应用_saeedMoaveni.rar        11.22 MB
│   ANSYS工程应用教程——机械篇 (刘国庆 杨庆东) A.rar        15.91 MB
│   ANSYS工程应用教程——热与电磁学篇.rar        21.05 MB
│   ANSYS流体分析.rar        399.91 KB
│   ANSYS融会与贯通 .rar        33.58 MB
│   Microstrp Radiators.rar        4.75 MB
│   MSC.PATRAN使用指南.rar        4.83 MB
│   Physics - Electromagnetic Field Theory (Theory and Problems).rar        2.83 MB
│   导线天线的分析与综合.rar        4.22 MB
│   电磁理论(外文).rar        7.07 MB
│   电脑辅助工程分析:ANSYS使用指南.rar        6.22 MB
│   晶体学基础及材料结构.rar        4.87 MB
│   雷达目标特征信号.rar        9.40 MB
│   流体力学有限元-哈工大-杨濯根.rar        2.93 MB
│   如何HFFS9中参扫、优化、和灵敏度分析.rar        735.28 KB
│   时域有限差分法(高本庆).rar        4.82 MB
│   实用工程数值模拟技术及其在ANSYS上的实践.rar        5.76 MB
│   天线测量.rar        3.27 MB
│   天线基础及应用.rar        259.79 KB
│   天线理论基础——任朗.rar        7.03 MB
│   微波技术基础.rar        8.18 MB
│   微带天线理论与工程.rar        4.40 MB
│   微带天线理论与应用.rar        2.90 MB
│   小波分析.rar        371.87 KB
│   有限元基础与ANSYS入门.rar        16.38 MB
│   有限元与ANSYS.rar        297.67 KB
│   粘弹性力学基础.rar        2.11 MB
│   最新经典 ANSYS[大型CAE书籍].rar        40.67 MB
├─pub        (11 folders, 1 files, 313.50 KB, 0.93 GB in total.)
│ │ Electrical Package Characterization.pdf        313.50 KB
│ ├─JEDEC标准        (2 folders, 1 files, 343.02 KB, 5.67 MB in total.)
│ │ │ fundamental of thermal performance.pdf        343.02 KB
│ │ ├─Failure Analysis        (0 folders, 13 files, 2.53 MB, 2.53 MB in total.)
│ │ │   22b117.pdf        47.76 KB
│ │ │   jep134.pdf        123.50 KB
│ │ │   jep136.pdf        131.93 KB
│ │ │   JESD28-1.pdf        54.74 KB
│ │ │   jesd38.pdf        283.31 KB
│ │ │   jesd659a.pdf        80.19 KB
│ │ │   jesd671a.pdf        81.58 KB
│ │ │   JESD74.pdf        723.13 KB
│ │ │   JESD85.pdf        501.95 KB
│ │ │   JESD87.pdf        90.87 KB
│ │ │   jesd91a.pdf        293.78 KB
│ │ │   JESD94.pdf        157.78 KB
│ │ │   RN_jeb16.pdf        19.33 KB
│ │ └─Thermal Test        (0 folders, 12 files, 2.80 MB, 2.80 MB in total.)
│ │     JESD51-10.pdf        102.64 KB
│ │     jesd51-1.pdf        564.46 KB
│ │     JESD51-11.pdf        211.93 KB
│ │     jesd51-2.pdf        66.74 KB
│ │     jesd51-3.pdf        334.67 KB
│ │     jesd51-4.pdf        314.07 KB
│ │     jesd51-5.pdf        56.35 KB
│ │     jesd51-6.pdf        472.30 KB
│ │     jesd51-7.pdf        308.68 KB
│ │     jesd51-8.pdf        74.49 KB
│ │     jesd51-9.pdf        213.09 KB
│ │     jesd51.pdf        152.63 KB
│ ├─厂商文档        (0 folders, 63 files, 27.62 MB, 27.62 MB in total.)
│ │   3080 High Reliability Flip Chip Underfill.pdf        530.81 KB
│ │   3083 Low Stress Underfill with Enhanced JEDEC Performance.pdf        297.27 KB
│ │   AOS Semiconductor Product Reliability Report.pdf        105.21 KB
│ │   basic semiconductor thermal measurement.pdf        66.29 KB
│ │   Building bridges between advanced semiconductor technology and the unusual.pdf        117.79 KB
│ │   COOLING CURVES CORRECT MEASUREMENT DATA.pdf        21.41 KB
│ │   COOLING METHODS FOR POWER SEMICONDUCTOR DEVICE AND DEVICE MOUNTING BETWEEN COOLING FINS.pdf        31.95 KB
│ │   Department of Microtechnology and Nanoscience.pdf        2.18 MB
│ │   Device Package User Guide.rar        4.00 MB
│ │   DIODES, THIN TYPE, SEMICONDUCTOR DEVICES, DISCRETE, HIGH RELIABILITY, SPACE USE, DETAIL SPECIFICATION FOR.pdf        329.14 KB
│ │   Ellecttrroniic Parrttss Obssollesscence IIniittiiattiive.pdf        1.81 MB
│ │   Field testing for cosmic ray soft errors in semiconductor memories.pdf        1.44 MB
│ │   Flywheel energy storage for quality power in the semiconductor production industry.pdf        284.85 KB
│ │   Guidelines for Soldering Surface Mount Components to PC Boards.pdf        17.64 KB
│ │   HIGH-TECH CERAMICS FOR SEMICONDUCTOR PROCESSING.pdf        1.20 MB
│ │   How to Determine Thermal Resistance for a Power Semiconductor Heat Sink in an SMPS.pdf        59.60 KB
│ │   IBM Microelectronics Technology Qualifications.pdf        430.73 KB
│ │   International Conference EXTENDED DEFECTS IN SEMICONDUCTORS.pdf        3.73 MB
│ │   IXYS-Power semiconductors Reliability, Life.pdf        44.50 KB
│ │   IXYS-RELIABILITY REPORT.pdf        161.45 KB
│ │   LASER DIODE BURN-IN AND RELIABILITY TESTING.pdf        386.18 KB
│ │   LCD Contrast Control Using Dallas Semiconductor Digital Potentiometers.pdf        158.89 KB
│ │   Meeting Semiconductor Needs for Cleanliness and Reliability.pdf        98.76 KB
│ │   Method for Measuring Thin Film Stress from Substrate Displacement.pdf        39.94 KB
│ │   Micrel’s Lead (Pb)- Free and ROHS Compliance Statement.pdf        93.00 KB
│ │   Micron_Tech_Note_THERMAL APPLICATIONS.pdf        122.90 KB
│ │   MOUNTING_OF_SURFACE_MOUNT_COMPONENTS-MISC.rar        917.94 KB
│ │   ON Semiconductor and Nantero, Inc., to Jointly Develop Carbon Nanotube Technology.pdf        70.82 KB
│ │   Optimizing Inventory at ON Semiconductor.pdf        101.92 KB
│ │   Package Thermal Characterization.pdf        78.54 KB
│ │   Performance Characteristics of IC Packages.rar        457.68 KB
│ │   Position opening at Aegis Semiconductor Inc. Principal Reliability Engineer.pdf        125.74 KB
│ │   Potential Thermal Security Risks.pdf        555.33 KB
│ │   Power_WEBENCH_Training_part3.pdf        440.48 KB
│ │   Precautionary Information for Handling of Semiconductor Devices.pdf        23.45 KB
│ │   Proven Performers in Semiconductor Manufacture.pdf        1.14 MB
│ │   pure si c cvd silicon carbide.pdf        218.15 KB
│ │   QNX and Freescale Semiconductor.pdf        333.44 KB
│ │   Quality and Reliability for Interface and Logic.pdf        34.43 KB
│ │   Reliability Considerations for Automotive FPGAs.pdf        149.11 KB
│ │   Reliability Monitor Data.pdf        90.57 KB
│ │   Reliability study of a semiconductor optical amplifier with spot-size converters (SS-SOA).pdf        28.53 KB
│ │   ReliabilityReport for axial mELF diodes manufactured at sensitron semiconductor.pdf        86.17 KB
│ │   Semiconductor Control Panel Heaters.pdf        90.96 KB
│ │   Semiconductor Device and Process Simulation.pdf        771.43 KB
│ │   Semiconductor Device Reliability Failure Models.pdf        160.47 KB
│ │   Semiconductor IC Packaging Technology Challenges The Next Five Years.pdf        230.53 KB
│ │   Semiconductor Packaging Assembly Technology.pdf        1.21 MB
│ │   Semiconductor Thermal Measurement and Management Symposium.pdf        40.96 KB
│ │   SEMICONDUCTOR THERMAL MEASUREMENT PROCEDURE.pdf        150.05 KB
│ │   Skyworks QualityReliability.pdf        45.38 KB
│ │   Standard Reliability Prediction Report.pdf        62.78 KB
│ │   Strain measurements of a Si cap layer deposited on a SiGe substrate determination of Ge content.pdf        244.24 KB
│ │   THE18th INTERNATIONAL CONFERENCE ON MAGNET TECHNOLOGY.pdf        841.39 KB
│ │   Thermal Characterization for Component Packages.pdf        628.99 KB
│ │   Thermal Characterization of Packaged Semiconductor Devices.pdf        200.01 KB
│ │   Thermal Stability of MOSFETs.pdf        87.74 KB
│ │   Understanding Soft and Firm Errors in Semiconductor Devices.pdf        119.18 KB
│ │   Uprating Semiconductors for High-Temperature Applications.pdf        104.02 KB
│ │   Use Condition Based Reliability Evaluation of New Semiconductor Technologies.pdf        111.71 KB
│ │   Using Dallas Semiconductor NV SRAMs in RAID Applications.pdf        56.77 KB
│ │   Using Integrated Modules to Improve Efficiency, Reliability and Size of Home Appliance Motor Drives.pdf        43.53 KB
│ │   Using the Thermal Impedance Model.pdf        71.61 KB
│ ├─封装材料        (2 folders, 18 files, 4.56 MB, 29.96 MB in total.)
│ │ │ 0084-1LMISR4.pdf        311.15 KB
│ │ │ 6600CS-Q_vs_CS-P.pdf        85.31 KB
│ │ │ DieAttachSoftSolders_0204.pdf        223.75 KB
│ │ │ EME-G700L.pdf        76.09 KB
│ │ │ FC-BGA CSP底层填充液体环氧封装材料.pdf        278.38 KB
│ │ │ G700series.PDF        382.25 KB
│ │ │ mat model.pdf        125.24 KB
│ │ │ material property used-2005-2-24.doc        36.50 KB
│ │ │ material property used.doc        36.50 KB
│ │ │ Physical Constants of IC Package Mat..pdf        100.98 KB
│ │ │ SMT reflow profile from J-STD-020.pdf        24.74 KB
│ │ │ Sumitomo G600.PDF        329.55 KB
│ │ │ TMA-0455-60136-CABGA-81-B.pdf        655.52 KB
│ │ │ 半导体用环氧树脂封装胶粉.rar        10.67 KB
│ │ │ 半导体用环氧树脂封装胶粉概况介绍.pdf        302.49 KB
│ │ │ 高密度多層構裝基板與接合材料研究(III)-子計畫三-新型低介電係數材料之製備及.pdf        50.63 KB
│ │ │ 碳奈米管環氧樹脂複合材料之製備及特性之研究.pdf        1.04 MB
│ │ │ 電子用含萘環氧樹脂之合成及性質研究.pdf        579.35 KB
│ │ ├─mems_materials        (0 folders, 44 files, 34.83 KB, 34.83 KB in total.)
│ │ │   Ag_blk_ln.SI_MPL        897 bytes
│ │ │   Al2O3_blk_ln.SI_MPL        1.26 KB
│ │ │   Al_blk_ln.SI_MPL        1.13 KB
│ │ │   Al_flm_ln.SI_MPL        732 bytes
│ │ │   AlN_blk_ln.SI_MPL        978 bytes
│ │ │   AlN_flm_ln.SI_MPL        514 bytes
│ │ │   Au_blk_ln.SI_MPL        901 bytes
│ │ │   C_Diamond_blk_ln.SI_MPL        636 bytes
│ │ │   C_Diamond_flm_ln.SI_MPL        510 bytes
│ │ │   Cu_blk_ln.SI_MPL        1.24 KB
│ │ │   DLC_blk_ln.SI_MPL        655 bytes
│ │ │   GaAs_blk_ln.SI_MPL        1.25 KB
│ │ │   Mo_blk_ln.SI_MPL        1.06 KB
│ │ │   Ni_blk_ln.SI_MPL        903 bytes
│ │ │   Ni_flm_ln.SI_MPL        489 bytes
│ │ │   Polyimide_flm_ln.SI_MPL        661 bytes
│ │ │   PolySi_blk_ln.SI_MPL        475 bytes
│ │ │   PolySi_flm_ln.SI_MPL        475 bytes
│ │ │   Pt_blk_ln.SI_MPL        953 bytes
│ │ │   Pt_flm_ln.SI_MPL        510 bytes
│ │ │   Si3N4_blk_ln.SI_MPL        1.26 KB
│ │ │   Si3N4_flm_ln.SI_MPL        681 bytes
│ │ │   Si_blk_ln.SI_MPL        1.20 KB
│ │ │   SiC_blk_ln.SI_MPL        1.28 KB
│ │ │   SiC_flm_ln.SI_MPL        644 bytes
│ │ │   SiO2_blk_ln.SI_MPL        992 bytes
│ │ │   SiO2_flm_ln.SI_MPL        803 bytes
│ │ │   Sn_blk_ln.SI_MPL        485 bytes
│ │ │   StSteel_blk_ln.SI_MPL        874 bytes
│ │ │   StSteel_flm_ln.SI_MPL        573 bytes
│ │ │   Ta_blk_ln.SI_MPL        637 bytes
│ │ │   Ti_blk_ln.SI_MPL        917 bytes
│ │ │   Ti_flm_ln.SI_MPL        471 bytes
│ │ │   TiC_blk_ln.SI_MPL        1.22 KB
│ │ │   TiC_flm_ln.SI_MPL        512 bytes
│ │ │   TiN_blk_ln.SI_MPL        877 bytes
│ │ │   TiN_flm_ln.SI_MPL        680 bytes
│ │ │   TiO2_blk_ln.SI_MPL        933 bytes
│ │ │   W_blk_ln.SI_MPL        1.06 KB
│ │ │   W_flm_ln.SI_MPL        514 bytes
│ │ │   WC_blk_ln.SI_MPL        891 bytes
│ │ │   Zn_blk_ln.SI_MPL        613 bytes
│ │ │   ZnO_blk_ln.SI_MPL        508 bytes
│ │ │   ZnO_flm_ln.SI_MPL        521 bytes
│ │ └─Silicon_paper        (0 folders, 44 files, 25.36 MB, 25.36 MB in total.)
│ │     A Microfabricated Thermal Field-Flow Fractionation System.pdf        471.54 KB
│ │     Alleviating Thermal Constraints While Maintaining Performance Via Silicon-Based On-Chip Optical Interconnects.pdf        202.31 KB
│ │     ANALYZING THE THERMAL ANNEALING BEHAVIOR OF LASER THERMAL PROCESSED SILICON.pdf        6.04 MB
│ │     Atomic structure of amorphous nanosized silicon powders upon thermal treatment.pdf        1.90 MB
│ │     Basic Mechanical and Thermal Properties of Silicon.pdf        225.49 KB
│ │     Biased-voltage controlled thinning for bonded silicon-on-insulator wafers.pdf        311.39 KB
│ │     Compressibility and thermal expansion of cubic silicon nitride.pdf        61.34 KB
│ │     Determining the thin-film thermal conductivity of low temperature PECVD silicon nitride.pdf        337.73 KB
│ │     Dielectric property and thermal stability of HfO2 on silicon.pdf        53.09 KB
│ │     Erratum to “Thermal conductivity of isotopically enriched silicon”.pdf        43.24 KB
│ │     Gallium Nitride on Silicon HEMTs - Thermal analysis.pdf        250.55 KB
│ │     Influence of Thermal Conductive Material on the Activation Energy of Amorphous Silicon Thin Films.pdf        107.25 KB
│ │     Integration of Expanding Thermal Plasma deposited hydrogenated amorphous silicon in solar cells.pdf        1.62 MB
│ │     Iron contaminants transport from silicon carbide hardware during thermal treatment at elevated temperatures.pdf        114.70 KB
│ │     Modeling of Thermal Conductivity of Thin Single Crystal SOI Layers.pdf        158.71 KB
│ │     Modeling of Thermal Resistance Dependence on Design Parameters in Silicon-on-Glass Bipolar Transistors.pdf        1.15 MB
│ │     Monte Carlo Simulation of Silicon Nanowire Thermal Conductivity.pdf        164.99 KB
│ │     ON THE THERMAL DEFORMATION ANALYSES OF CVD SILICON-CARBIDE MIRROR.pdf        73.32 KB
│ │     Performance limits of direct cryogenically cooled silicon monochromators.pdf        92.17 KB
│ │     Photon effect on radiative properties of silicon during rapid thermal processing.pdf        127.59 KB
│ │     Properties of Ultra-Thin Thermal Silicon Nitride.PDF        816.01 KB
│ │     Rapid Thermal Processing Enhanced Hydrogenation and Screen-Printed Contacts in Silicon Ribbon Solar Cells.pdf        306.21 KB
│ │     RAPID THERMAL PROCESSING OF HIGH EFFICIENCY N-TYPE SILICON SOLAR CELLS WITH AL BACK JUNCTION.pdf        929.75 KB
│ │     RAPID THERMAL PROCESSING OF HIGH EFFICIENCY N-TYPE SILICON SOLAR CELLS WITH AL BACK JUNCTIONr.pdf        28.35 KB
│ │     Rapid Thermal Technologies for High Efficiency Silicon Solar Cells.pdf        154.53 KB
│ │     Research of Isotopic Effect on Surface of Silicon After Thermal Annealing and Electronic Irradiation.pdf        119.80 KB
│ │     Resistance fluctuations in hydrogenated amorphous silicon Thermal equilibrium.pdf        227.62 KB
│ │     Shallow Thermal Donor Defects in Silicon.pdf        99.84 KB
│ │     Silicon Clusters of Intermediate Size Energetics, Dynamics, and Thermal Effects.pdf        460.76 KB
│ │     SILICON ELECTROOSMOTIC MICROPUMPS FOR INTEGRATED CIRCUIT THERMAL MANAGEMENT.pdf        601.42 KB
│ │     SILICON OXIDE DECOMPOSITION AND DESORPTION DURING THE THERMAL OXIDATION OF SILICON.pdf        370.05 KB
│ │     Silicon Tunnel Diodes Formed by Proximity Rapid Thermal Diffusion.pdf        266.58 KB
│ │     Simulation of picosecond pulsed laser ablation of silicon— the molecular-dynamics thermal-annealing model.pdf        143.51 KB
│ │     THE EFFECT OF THE THERMAL ANNEALING ON THE POROUS SILICON PHOTONIC CRYSTAL.pdf        21.77 KB
│ │     Thermal CVD Film-Silicon On SiAlON Based Ceramic Substrates.pdf        364.02 KB
│ │     THERMAL EXPANSION COEFFICIENT OF COLD-PRESSED SILICON CARBIDE.pdf        328.54 KB
│ │     Thermal Oxidation-induced Strain In Silicon Nanobeams.pdf        4.56 MB
│ │     Thermal Performance Challenges from Silicon to Systems.pdf        743.37 KB
│ │     Thermal stability of internal gettering of iron in silicon and its impact on optimization of gettering.pdf        52.52 KB
│ │     Thermal stability of metastable silicon phases produced by nanoindentation.pdf        530.92 KB
│ │     Thermal stability of stacked high-k dielectrics on silicon.pdf        60.61 KB
│ │     Thin FilmMorphology and GrowthMechanism of Pentacene Thin Film Using Low- Pressure Organic Vapor Deposition.PDF        673.79 KB
│ │     Ts-3 amorphous-silicon photovoltaicthermal solar collector in thailand.pdf        158.97 KB
│ │     Ultrathin SiOxNy by rapid thermal heating of silicon in N2 at T5760– 1050 °C.pdf        74.06 KB
│ ├─封装基础        (0 folders, 39 files, 61.25 MB, 61.25 MB in total.)
│ │   (3)微電子構裝可靠度設計 Charles Handout Oct 19.pdf        1.29 MB
│ │   (4)先進構裝與晶圓級構裝基本原理 for 2004-1026 1102.pdf        3.67 MB
│ │   (7)封裝實務與電路板組裝_Charles 2004 2005.pdf        3.30 MB
│ │   5ch 电子封装技术发展趋势.rar        891.60 KB
│ │   6ch IC封装材料发展趋势.rar        1.48 MB
│ │   _Basics of SemiconductorMEMS Fabrication.pdf        2.21 MB
│ │   BGA封装的安装策略.rar        38.39 KB
│ │   IC_组织显微检测方法.rar        932.95 KB
│ │   IC封装术语.rar        11.13 KB
│ │   IC與微系統構裝.pdf        5.97 MB
│ │   Impacts of Lead-Free Soldering on Wafer-Level Chip Scale Packages.rar        6.40 MB
│ │   MEMS-PME.rar        3.95 MB
│ │   mems器件气密封装工艺规范(材料参数).rar        360.61 KB
│ │   PCB制造工艺综述.rar        179.37 KB
│ │   SEMICONDUCTOR_PACKAGING_ASSEMBLY_TECHNOLOGY-MISC.rar        1.16 MB
│ │   smt术语.rar        99.52 KB
│ │   半導體封裝.pdf        4.20 MB
│ │   半導體技術的奈米之路.pdf        374.86 KB
│ │   薄膜成形技術新紀元.pdf        1.74 MB
│ │   单元5 表面组装装技术基础.rar        462.81 KB
│ │   倒装芯片工艺挑战SMT组装.rar        16.94 KB
│ │   电子封装技术.rar        0.97 MB
│ │   电子设备限制使用的六种有害物质的检测分析.rar        29.54 KB
│ │   各种IC封装形式图片及简称.rar        1.05 MB
│ │   各种封装形式.rar        11.08 KB
│ │   光电子封装--制造的新纪元.rar        22.16 KB
│ │   集成电路封装知识.rar        260.74 KB
│ │   晶片倒贴装技术.pdf        153.99 KB
│ │   晶圆制造与封装.rar        323.97 KB
│ │   可靠性技术彰显威力,高速电路难题迎刃而解.rar        89.76 KB
│ │   破坏物理分析技术的应用.rar        25.10 KB
│ │   微機電產業關鍵成功要素.rar        200.15 KB
│ │   微电子封装基础-Training material.rar        4.21 MB
│ │   微电子封装及微连接.rar        7.10 MB
│ │   微电子与集成电路.rar        1.07 MB
│ │   微電子封裝基礎與設計.pdf        4.41 MB
│ │   微電子技術導論.rar        828.21 KB
│ │   新型微电子封装技术.rar        40.47 KB
│ │   转注成型封装材料.rar        1.84 MB
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  • heusxg (2006-12-14 14:39:32)

    │ ├─期刊论文        (8 folders, 0 files, 0 bytes, 267.07 MB in total.)
    │ │ ├─MEMS        (0 folders, 76 files, 31.68 MB, 31.68 MB in total.)
    │ │ │   A MEMS-Based, High-Sensitivity Pressure Sensor for Ultraclean Semiconductor Applications.pdf        154.10 KB
    │ │ │   A Mechanical Approach to Overcome RF MEMS Switch Stiction Problem.pdf        284.32 KB
    │ │ │   A New Type of High Bandwidth RF MEMS Switch - Toggle Switch.pdf        1.09 MB
    │ │ │   A SIMULATION STUDY ON RELEASE, SYNCHRONIZATION, AND DISPATCHING IN MEMS FABRICATION.pdf        286.25 KB
    │ │ │   ADAPTIVE MODELING AND DESIGN OF PACKAGING MICROSYSTEMS AND MEMS FOR WIRELESS COMMUNICATION MODULES.pdf        65.79 KB
    │ │ │   AlCu Pattern Generation on 3D StructuredWafer Using Multi Level Exposure Method on Electrodeposited Polymer Material.PDF        238.60 KB
    │ │ │   Analytical Simulation of a 1D Single Crystal Silicon Electrostatic Micromirror.pdf        139.64 KB
    │ │ │   ANSYS FEA of MEMS Switch.pdf        709.37 KB
    │ │ │   Basics of SemiconductorMEMS Fabrication.pdf        2.21 MB
    │ │ │   CMP Revisited for the MEMSFoundry Era.PDF        795.96 KB
    │ │ │   Computational Methods for Reduced Order Modeling of Coupled Domain Simulations.pdf        681.83 KB
    │ │ │   Development of CAD Model for MEMS Micropumps.pdf        140.66 KB
    │ │ │   DuPont Semiconductor Packaging & Circuit Materials.pdf        0.99 MB
    │ │ │   Electro-Mechanical Transducer for MEMS Analysis in ANSYS.pdf        168.45 KB
    │ │ │   Epson Using MEMS to Create Advanced Inkjet Heads for POS Printers.pdf        1.14 MB
    │ │ │   Evolution of the MEMS manufacturing activities.pdf        515.18 KB
    │ │ │   finite element based reduced order modeling of MEMS.pdf        129.19 KB
    │ │ │   First Demonstration of a MEMS Tunable Vertical-Cavity SOA.pdf        161.69 KB
    │ │ │   Freescale MEMS Sensors.pdf        101.97 KB
    │ │ │   Fundamental MEMS, an Introduction to MicroElectroMechanical Systems (MEMS).pdf        59.89 KB
    │ │ │   Hybrid Finite Element - Trefftz Method for Open Boundary Analysis.pdf        23.15 KB
    │ │ │   Hybrid P-Element and Trefftz Method for Capacitance Computation.pdf        184.57 KB
    │ │ │   Introductory MEMS technology using Bulk Micromachining in the Semiconductor Manufacturing Curriculum.pdf        234.05 KB
    │ │ │   Investigate the reliability of electrostatic comb-drive actuator utilized in microfludic and space systems using FEA.pdf        777.23 KB
    │ │ │   Ion trap in a semiconductor chip.pdf        726.75 KB
    │ │ │   Low g Inertial Sensor based on High Aspect Ratio MEMS.pdf        629.53 KB
    │ │ │   Low-temperature MEMS processing for intelligent MEMS over CMOS.pdf        2.66 MB
    │ │ │   maloratsky_micostrip.pdf        126.14 KB
    │ │ │   MEMS applications of Ball Semiconductor Technology.pdf        1.48 MB
    │ │ │   MEMS Expanding Functionality with Miniature Silicon Devices.pdf        140.29 KB
    │ │ │   MEMS Micro-switched and their application to Infromation Technology.pdf        15.42 KB
    │ │ │   MEMS Product Development A Foundry Looks at itsr Customers and the State of the Industry.pdf        101.53 KB
    │ │ │   MEMS Technology.pdf        143.77 KB
    │ │ │   MEMS-based embedded sensor virtual components for system-on-a-chip (SoC).pdf        434.57 KB
    │ │ │   mems-solutions-1.pdf        919.24 KB
    │ │ │   mems-solutions-2.pdf        831.71 KB
    │ │ │   mems-solutions-3.pdf        205.01 KB
    │ │ │   mems-solutions-4.pdf        145.00 KB
    │ │ │   mems-solutions-fall-01-m3.pdf        97.88 KB
    │ │ │   mems-solutions-spring-01-m1.pdf        87.49 KB
    │ │ │   mems-solutions-summer-01-m2.pdf        91.98 KB
    │ │ │   mems-thermal-analogy-fsi-damping.pdf        228.35 KB
    │ │ │   MEMSCAP AND TANNER EDA FIRST TO OFFER MULTI-PLATFORM MEMS DESIGN FLOW THROUGH EXCLUSIVE AGREEMENT.pdf        63.95 KB
    │ │ │   MemsNanotechSemiconductorTerms.pdf        311.62 KB
    │ │ │   MetroPro Films Analysis Application.pdf        553.84 KB
    │ │ │   Micro Electromechanical Systems Move Toward Standardization By Siebe Bouwstra, Mark da Silva, Gerold Schropfer, Coventor Inc..pdf        83.62 KB
    │ │ │   Microwave Laminate PCB Compatible RF MEMS Technology for Wireless Communication Systems.pdf        453.96 KB
    │ │ │   Millimeter-Wave and Terahertz Devices Based on MEMS Concepts.pdf        658.26 KB
    │ │ │   modeling approach for CVD-diamound based mechanical structures.pdf        137.09 KB
    │ │ │   Modeling of the Piezoelectric Micropump for Improving the Working Parameters.pdf        94.41 KB
    │ │ │   Nanoelectronics and MEMS Materials and Equipment Markets.pdf        245.37 KB
    │ │ │   Nanoscale Elasticity and Quantum Effects in Artificial Semiconductor Structures.pdf        1.37 MB
    │ │ │   Nanotechnology Solutions — Today.pdf        966.88 KB
    │ │ │   Novel fabrication and simple hybridization of exotic material MEMS.pdf        1.12 MB
    │ │ │   Numerical And Analytical Modeling Of The Piezoelectric Transformer And Experimental Verification.pdf        140.95 KB
    │ │ │   Numerical simulations of flat-walled diffuser elements for valveless micropumps.pdf        439.26 KB
    │ │ │   Olympus's MEMS Foundry Service.pdf        43.85 KB
    │ │ │   Position Paper MEMS Perspectives from Industry, Education and Legislature.pdf        12.25 KB
    │ │ │   Promise and Progress of GaAs MEMS and MOEMS.pdf        665.55 KB
    │ │ │   PZT ACTUATED MICROMIRROR FOR NANO-TRACKING OF LASER BEAM FOR HIGH-DENSITY OPTICAL DATA STORAGE.pdf        218.01 KB
    │ │ │   Q-Optimized Lateral Free-Free Beam Micromechanical Resonators.pdf        120.76 KB
    │ │ │   Quality based design and design for reliablity of micro electro mechanical systems using probabilistic methods.pdf        146.30 KB
    │ │ │   Reducing MEMS product development and commercialization time.pdf        300.31 KB
    │ │ │   RoseStreet Labs Announces 3D & MEMs Packaging R&D Laboratory and Alliance with SUSS MicroTec.pdf        13.69 KB
    │ │ │   simple APDL implementation of a 3D FEM simulator for mutual capacitances of arbitrarily shaped objects like interconnects.pdf        455.80 KB
    │ │ │   STRUCTURAL MODELING AND PROBABILISTIC CHARACTERIZATION OF MEMS pressure sensor.pdf        572.83 KB
    │ │ │   The European Activities in MEMSMST Standardization, a brief Overview.pdf        78.52 KB
    │ │ │   THE IMPACT OF MEMS ON CELLULAR PHONE ARCHITECTURES.pdf        632.16 KB
    │ │ │   Toward the Development of Hybrid MEMS Tunable Optical Filters and Lasers.pdf        512.59 KB
    │ │ │   Towards Optimal IO Scheduling for MEMS-based Storage.pdf        135.71 KB
    │ │ │   Triangle Transducer for micro electro mechanical system simulation in ansys program.pdf        886.96 KB
    │ │ │   Undergraduate IC-MEMS Processing Laboratory.pdf        18.79 KB
    │ │ │   Une comparaison entre des interrupteurs RF MEMS et des interrupteurs `a semiconducteurs.pdf        10.10 KB
    │ │ │   using a heat transfer analogy to solve for squeeze film damping and stiffness coefficient in mems structures.pdf        228.35 KB
    │ │ │   WAFER BONDING TECHNOLOGIES IN INDUSTRIAL MEMS PROCESSING.pdf        22.55 KB
    │ │ │   What are microsystems.rar        98.68 KB
    │ │ ├─RF技术        (0 folders, 33 files, 6.50 MB, 6.50 MB in total.)
    │ │ │   28th IEEE COMPOUND SEMICONDUCTOR IC (CSIC) SYMPOSIUM.pdf        99.60 KB
    │ │ │   A Laboratory Approach to RF Power Technology for Semiconductor Manufacturing.pdf        18.94 KB
    │ │ │   A New Integrated Metal-Semiconductor Simulation Methodology for On-Chip Electrostatic Discharge Protection Design Optimization.pdf        141.61 KB
    │ │ │   Active passive and RF-Active RF-Passive Tags.pdf        444.16 KB
    │ │ │   Agilent's Advanced Design System RF High Power Products Design Kit Release v2005ap0806.pdf        364.00 KB
    │ │ │   Course description RF Device Characterisation.pdf        188.44 KB
    │ │ │   Course description RF Semiconductor Materials and Devices.pdf        154.19 KB
    │ │ │   DEPARTMENT OF ELECTRICAL ENGINEERING The Ohio State University Course Syllabus.pdf        602.73 KB
    │ │ │   DEVELOPMENT OF HIGH POWER X-BAND SEMICONDUCTOR RF SWITCH FOR PULSE COMPRESSION SYSTEMS OF FUTURE LINEAR COLLIDERS.pdf        87.24 KB
    │ │ │   Dual Function Semiconductor Electroabsorption Device For Optoelectronic RF Transceiver.pdf        80.10 KB
    │ │ │   Dual Function Semiconductor Electroabsorption Device For Optoelectronic RF Transceiver2.pdf        57.55 KB
    │ │ │   ep-news_in_mstnews_5_2004.pdf        241.06 KB
    │ │ │   FABLESS SEMICONDUCTOR INDUSTRY ASSOCIATION [FSA].pdf        96.57 KB
    │ │ │   Fairchild Semiconductor Product Catalog.pdf        647.47 KB
    │ │ │   GB-196R — Compound Semiconductor Materials Technology, Development and Market Trends.pdf        190.11 KB
    │ │ │   gps rf mod.pdf        98.56 KB
    │ │ │   Growth of mirror-like Zn1-xMnxO diluted magnetic semiconductor thin films by r.f. magnetron sputtering method.PDF        384.69 KB
    │ │ │   HIGH POWER X-BAND SEMICONDUCTOR RF SWITCH FOR PULSE COMPRESSION SYSTEMS OF FUTURE LINEAR COLLIDERS.pdf        82.25 KB
    │ │ │   MagLatch The Superior RF Switch Technology.pdf        119.04 KB
    │ │ │   Management Team Biographies Supercharged Silicon for the Wireless World.pdf        26.74 KB
    │ │ │   Metalsemiconductor phase transition in chromium nitride(001) grown by rf-plasma-assisted molecular-beam epitaxy.pdf        230.76 KB
    │ │ │   Micromechanical RF Switches.pdf        430.34 KB
    │ │ │   New ICP Technology for Semiconductor Material Processing.pdf        287.83 KB
    │ │ │   NuHorizons-Nordic-SC.pdf        244.72 KB
    │ │ │   PEREGRINE SEMICONDUCTOR INTRODUCES FAMILY OF MILITARY QUALITY RF ICs.pdf        72.47 KB
    │ │ │   Plasma and RF Fundamentals.pdf        34.28 KB
    │ │ │   RF  Microwave Product Integration.pdf        267.83 KB
    │ │ │   RF & WIRELESS.pdf        371.31 KB
    │ │ │   RF Cathode Assembly.pdf        60.67 KB
    │ │ │   RF EDA moves from niche to mainstream.pdf        50.82 KB
    │ │ │   RF Test Services.pdf        180.56 KB
    │ │ │   The evolution of RF power delivery in plasma processing.pdf        291.70 KB
    │ │ │   TPC Analog Contact List_2006-3-20-06[Analog, RF, & Microwave Subcommittee].pdf        12.39 KB
    │ │ ├─分层        (0 folders, 26 files, 17.51 MB, 17.51 MB in total.)
    │ │ │   Berechnung fortschreitender Risse in Laminaten.pdf        407.54 KB
    │ │ │   Characteristic dimensions and the micro-mechanisms of fracture and fatigue in ‘nano’ and ‘bio’ materials.pdf        688.57 KB
    │ │ │   Characterization of chip scale packaging materials.pdf        330.10 KB
    │ │ │   Contributions of advective and diffusive oxygen transport through multilayer composite caps over mine waste.pdf        1.16 MB
    │ │ │   Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration.PDF        3.29 MB
    │ │ │   Dissimilar Material Joints With and Without Free-edge Stress Singularities.pdf        201.69 KB
    │ │ │   Effect of Packaging on Interfacial Fracture in CuLow k Damascene Structures.pdf        259.82 KB
    │ │ │   Finite element analyses of mode I interlaminar delamination in z-fibre reinforced composite laminates.pdf        530.01 KB
    │ │ │   FINITE ELEMENT ANALYSIS OF A FUEL CELL MEMBRANE-ELECTRODE ASSEMBLY UNDER COMPRESSION.pdf        128.84 KB
    │ │ │   Finite Element Analysis of Stress Distributions in Interconnect Structures.pdf        46.09 KB
    │ │ │   FLIP CHIP PBGA SOLDER JOINT RELIABILITY POWER CYCLING VERSUS THERMAL CYCLING.pdf        559.30 KB
    │ │ │   Fracture of SkinStiffener Intersections in Composite Wind Turbine Structures.pdf        581.74 KB
    │ │ │   Fracture Toughness of Through-Thickness Reinforced Composites.pdf        226.50 KB
    │ │ │   Lead-Free Wave-Soldering and Reliability of Light-Emitting Diode (LED) Display Assemblies.pdf        1.97 MB
    │ │ │   MICROMECHANISMS AND MECHANICS OF DAMAGE AND FRACTURE IN THIN FILMSUBSTRATE SYSTEMS.pdf        402.62 KB
    │ │ │   Modeling of Diffusion Through Optical Fiber Coatings.pdf        166.30 KB
    │ │ │   Moisture Diffusion through a Corrugated Fiberboard under Compres-sive Loading Its Deformation and Stiffness Response.pdf        95.77 KB
    │ │ │   NUMERICAL MODELING AND ANALYSIS OF PLAIN CONCRETE NOTCHED BEAMS BY MEANS OF FRACTURE MECHANICS.pdf        317.33 KB
    │ │ │   On The Mechanism of Fatigue in Micron-Scale Structural Films of Polycrystalline Silicon.PDF        2.27 MB
    │ │ │   Optimization design and residual thermal stress analysis of PDC functionally graded materials.pdf        389.18 KB
    │ │ │   Reliability of Interface under Accelerated Temperature Cycling.pdf        887.36 KB
    │ │ │   SOLDER LIFE PREDICTION IN A THERMAL ANALYSIS SOFTWARE ENVIRONMENT.pdf        623.90 KB
    │ │ │   The research of the random component of air flow velocity in the cylinder of the internal combustion engine.pdf        270.73 KB
    │ │ │   The Thermo-mechanical Effect of Different Components on Taped Ball Grid Array (TBGA) Package.pdf        521.81 KB
    │ │ │   Thermal Cycling Aging Effects on Microstructural and Mechanical Properties of a Single PBGA Solder Joint Specimen.pdf        879.58 KB
    │ │ │   Three-Dimensional Progressive Damage Analysis of Composite Joints.pdf        517.28 KB
    │ │ ├─建模        (0 folders, 131 files, 59.13 MB, 59.13 MB in total.)
    │ │ │   2A704 Robust design for efficient use of nanometre technologies (ROBIN).pdf        119.24 KB
    │ │ │   4O-Gbh Optical Buffer Design and Simulation.pdf        135.52 KB
    │ │ │   A Framework for Standard Modular Simulation Application to Semiconductor Wafer Fabrication.pdf        280.27 KB
    │ │ │   A New Integrated Metal-Semiconductor Simulation Methodology for On-Chip Electrostatic Discharge Protection Design Optimization.pdf        141.61 KB
    │ │ │   A novel simulation strategy for ultrafast InPInGaAsP optoelectronic modulator’s analysis.pdf        594.91 KB
    │ │ │   A Physics Based Model of Pixellated Semiconductor Gamma Camera.pdf        79.68 KB
    │ │ │   A Primer on Semiconductor Device Simulation.pdf        1.23 MB
    │ │ │   A SENSORIZED μELECTRO DISCHARGE MACHINED SUPERELASTIC ALLOY MICROGRIPPER FOR MICROMANIPULATION.pdf        271.26 KB
    │ │ │   a simulation study of dispatching rules and rework strategies in semiconductor manufacturing.pdf        417.29 KB
    │ │ │   A Web-Based Course in Chemical Engineering Fundamentals and Design of Microelectronics Processing.pdf        36.59 KB
    │ │ │   Ab initio-based modeling of III-V semiconductor surfaces Thermodynamic equilibrium and growth kinetics on atomic scales.pdf        4.82 MB
    │ │ │   accelerated waveform methods for parallel transient simulation of semiconductor devices.pdf        0.99 MB
    │ │ │   Accelerating the transient simulation of semiconductor devices using filter-bank transforms.pdf        529.96 KB
    │ │ │   accounting for incomplete ionization in modeling silicon based semiconductor devices.pdf        328.24 KB
    │ │ │   Adaptive Numerical Modeling of RF Structures Requiring the Coupling of Maxwell's, Mechanical and Solid-State Equations.pdf        173.00 KB
    │ │ │   advanced in modeling optical fiber transmission systems.pdf        151.58 KB
    │ │ │   Algebraic Multigrid for Industrial Semiconductor Device Simulation.pdf        778.22 KB
    │ │ │   An Agent-based Approach for Managing Symbiotic Simulation of Semiconductor Assembly and Test Operation.pdf        698.13 KB
    │ │ │   An Index Analysis from Coupled Circuit and Device Simulation.pdf        140.98 KB
    │ │ │   An Intelligent VLSI System Based on Psychologically-Inspired Semiconductor Brain Model.pdf        825.88 KB
    │ │ │   An Interactive Tool in Gallium Arsenide Semiconductor Modeling..pdf        696.14 KB
    │ │ │   An Object Oriented Model for Multiple-Site Semiconductor Manufacturing Enterprises.pdf        209.63 KB
    │ │ │   An Object-Oriented Neural Network Simulator for Semiconductor Manufacturing Applications.pdf        331.89 KB
    │ │ │   analytic modeling of monolithic inductors on semiconductor substrates.pdf        257.76 KB
    │ │ │   atomistic simulation of nanoscaled devices.pdf        388.86 KB
    │ │ │   Automatic Generation of Compact Semiconductor Device Models using Paragon and ADMS.pdf        516.78 KB
    │ │ │   BUILDING A MORE ACCURATE OUTPUT PREDICTION MODEL FOR DOMINION SEMICONDUCTOR COMPARING EFFECTS OF MACHINE TIME-TO-FAIL AND DOWNTIME DISTRIBUTION ESTIMATORS ON MODEL ACCURACY.pdf        176.57 KB
    │ │ │   Calibration of semiconductor optical amplifier simulator for switching action prediction.pdf        168.10 KB
    │ │ │   CHARACTERIZATION AND SIMULATION OF SEMICONDUCTOR DEVICES ELECTROSTATIC DISCHARGE PROTECTION IN MICROWAVE CIRCUIT APPLICATION.pdf        140.12 KB
    │ │ │   Creative Solutions to Some Problems in Semiconductor Device Modeling and Fabrication.pdf        345.06 KB
    │ │ │   Critical modeling issues of SiGe semiconductor devices.pdf        1.70 MB
    │ │ │   CRITICALITY OF DETAILED MODELING IN SEMICONDUCTOR SUPPLY CHAIN SIMULATION.pdf        134.80 KB
    │ │ │   Design of Scalable Simulation Models for Semiconductor Manufacturing Processes.pdf        238.53 KB
    │ │ │   Domain decomposition methods in semiconductor device modeling.pdf        74.90 KB
    │ │ │   Dynamic Simulator for WIP Analysis in Semiconductor Manufacturing.pdf        133.85 KB
    │ │ │   Education in Semiconductor Manufacturing Processes through Physically-Based Dynamic Simulation.pdf        56.48 KB
    │ │ │   Efficient CFD Modeling Of SingleWafer Semiconductor Fabrication Systems For Closed-Loop Evaluation.pdf        81.18 KB
    │ │ │   Efficient Modeling of PIN Diode Switches Employing Time-Domain Electromagnetic-Physics-Based Simulators.pdf        290.56 KB
    │ │ │   Electrical Domains and Sub-millimeter Signal Generation in AlGaNGaN Superlattices.PDF        131.26 KB
    │ │ │   Electrical simulation of scanning capacitance microscopy imaging of the pn junction with semiconductor probe tips.pdf        246.00 KB
    │ │ │   ErAsInGaAs superlattice Seebeck coefficient.pdf        128.34 KB
    │ │ │   Experiment and Simulation on the Reduction of the Semiconductor Optical Amplifier Optoelectronic Switching Time.pdf        443.55 KB
    │ │ │   Fast Loss Predicting Prototyping Tools for Power Electronics.pdf        351.07 KB
    │ │ │   Flexible by B. R. Tibbitts simulation of a complex semiconduc or manufacturing line using a rule-based system.pdf        3.88 MB
    │ │ │   Fundamentals of Semiconductor Devices Lab #4 – pn Junction Simulation.pdf        155.00 KB
    │ │ │   Getting and Using IBIS Models – Tips & Tricks at CommWorks.pdf        14.79 KB
    │ │ │   Hinge Sensitivity in a Micro-Rotating Structure for predicting Induced Thermo Mechanical Stress in Integrated Circuit Metal Interconnects.PDF        861.48 KB
    │ │ │   HYBRID DISCRETE EVENT SIMULATION WITH MODEL PREDICTIVE CONTROL FOR SEMICONDUCTOR SUPPLY-CHAIN MANUFACTURING.pdf        412.23 KB
    │ │ │   Integrated Computatoinal Chemistry Approach to the Semiconductor Process Simulation.pdf        279.59 KB
    │ │ │   integrated_atomistic_process and device simulation of decananometre MOSFETs.pdf        416.27 KB
    │ │ │   Iterative versus direct parallel substructuring methods in semiconductor device modeling.pdf        488.16 KB
    │ │ │   Kinetic model of II-VI(001) semiconductor surfaces Growth rates in atomic layer epitaxy.pdf        1.45 MB
    │ │ │   MATHEMATICAL ANALYSIS OF EXTENDED SEMICONDUCTOR DEVICE MODELS.pdf        103.44 KB
    │ │ │   Mathematical Modeling.pdf        71.77 KB
    │ │ │   Measurement and modeling of propagation loss in semiconductor racetrack micro-resonators.pdf        49.95 KB
    │ │ │   Microfabrication services at INO.pdf        1.04 MB
    │ │ │   Model calculations of vertical cavity air-gap filters and VCSEL’s for ultra-wide continuous tuning.pdf        281.00 KB
    │ │ │   Model Reduction for Power Electronics Systems with Multiple Heat Sources.pdf        422.55 KB
    │ │ │   MODELING A DISTRIBUTED SPATIAL FILTER LOW-NOISE SEMICONDUCTOR OPTICAL AMPLIFIER.pdf        932.94 KB
    │ │ │   Modeling and 2d–Simulation of Quantum–Well Semiconductor Lasers including the Schr¨odinger–Poisson system.pdf        88.33 KB
    │ │ │   Modeling and Simulation of Metal-Semiconductor-Metal Photodetector using VHDL-AMS.pdf        263.39 KB
    │ │ │   Modeling and simulation of strained quantum wells in semiconductor lasers.pdf        115.22 KB
    │ │ │   Modeling bidirectionally coupled single-mode semiconductor lasers.pdf        244.22 KB
    │ │ │   Modeling of ballistic nanoscale metal-oxide-semiconductor field effect transistors.pdf        57.40 KB
    │ │ │   modeling of distributed feedback semiconductor lasers with axially-varying parameters.pdf        656.59 KB
    │ │ │   Modeling of Fowler-Nordheim current of metal ultra-thin oxide semiconductor structures.pdf        182.18 KB
    │ │ │   Modeling of high power semiconductor switches operated in the nonlinear mode.pdf        190.31 KB
    │ │ │   Modeling of Nitride Semiconductor Based Double Heterostructure Tunnel Diodes.PDF        502.79 KB
    │ │ │   Modeling of Optical Nonlinearities Based on Engineering the Semiconductor Band.pdf        261.97 KB
    │ │ │   Modeling of quantum well semiconductor lasers based on Green’s functions.pdf        234.96 KB
    │ │ │   Modeling of Semiconductor Nanostructures with nextnano.pdf        679.91 KB
    │ │ │   MODELING OF SILICON WAFER VIBRATION IN SEMICONDUCTOR PROCESS TOOLS.pdf        219.57 KB
    │ │ │   Modeling of the Electrostatic (Plasmon) Resonances in Metallic and Semiconductor Nanoparticles.pdf        133.04 KB
    │ │ │   Modeling of the Properties and Processing of Amorphous Gate Stacks on High Electron Mobility Materials.pdf        12.34 KB
    │ │ │   Modeling Semiconductor Crystal Growth with Magnetic Fields.pdf        5.63 KB
    │ │ │   MODELING SEMICONDUCTOR OPTICAL DEVICES.pdf        611.70 KB
    │ │ │   Modelling and simulation of power electronic systems using a bond graph formalism.pdf        242.89 KB
    │ │ │   Modelling for semiconductor spintronics.pdf        303.84 KB
    │ │ │   Models and Data for Semiconductor Processing.pdf        143.15 KB
    │ │ │   Neutron-induced semiconductor soft error simulation using the PHITS Monte Carlo simulator.pdf        351.31 KB
    │ │ │   New approach to power semiconductor devices modeling.pdf        2.75 MB
    │ │ │   NONEQUILIBRIUM TRANSPORT IN NANOSCALE SEMICONDUCTOR DEVICES.pdf        332.72 KB
    │ │ │   Nonlinear Modeling of Step Recovery Diodes Using Verilog-A.pdf        259.77 KB
    │ │ │   Numerical Analysis of DAEs from Coupled Circuit and Semiconductor Simulation.pdf        212.85 KB
    │ │ │   Numerical modeling of frequency influence on the electromagnetic stirring of semiconductor melts.pdf        408.76 KB
    │ │ │   numerical simulation of 2D semiconductor devices using high-order conservative finite difference methods.pdf        578.24 KB
    │ │ │   Numerical Simulation of Doping Processes.pdf        483.39 KB
    │ │ │   Numerical simulation of modal gain in electrically pumped organic semiconductor lasers.pdf        131.19 KB
    │ │ │   Numerical Simulation of Nonlinear and Parametric Oscillations in a Semiconductor Resonator Structure.pdf        303.23 KB
    │ │ │   On Using Collocation in Three Dimensions and Solving a Model Semiconductor Problem.pdf        205.19 KB
    │ │ │   Optical constants of methyl-pentaphenylsilole by spectroscopic ellipsometry.pdf        145.78 KB
    │ │ │   Overview of research activities on the simulation of High frequency devices, circuits and systems using the ScilabScicos Environment.pdf        1.34 MB
    │ │ │   Parallel Semiconductor Device Simulation from Power to ‘Atomistic’ Devices.pdf        618.18 KB
    │ │ │   Physical models for coupled electromechanical analysis of silicon nanoelectromechanical systems.pdf        371.44 KB
    │ │ │   Process-Oriented Stress Modeling and Stress Evolution During CuLow-K BEOL Processing.PDF        202.62 KB
    │ │ │   recursive simulation models of the semiconductor laser modulation characteristics for accurate performance evaluation of coherent optical cpfsk system.pdf        1.16 MB
    │ │ │   Segmental Semi-Markov Models for Change-Point Detection with Applications to Semiconductor Manufacturing.pdf        153.05 KB
    │ │ │   Semiclassical Transport Models for Semiconductor Spintronics.pdf        890.43 KB
    │ │ │   Semiconductor Device Simulation Using Filter Bank Transforms.pdf        1.06 MB
    │ │ │   Semiconductor device simulation using generalized mobility models.pdf        1.51 MB
    │ │ │   Semiconductor Device Simulation.pdf        436.52 KB
    │ │ │   Semiconductor Modeling for Multi-layer, High Field, Photo-Switch using sub-bandgap Photons.pdf        185.48 KB
    │ │ │   SEMICONDUCTOR SIMULATIONS USING A COUPLED QUANTUM DRIFT-DIFFUSION SCHR¨ ODINGER-POISSON MODEL.pdf        287.18 KB
    │ │ │   Simulation & Scheduling Companions or Competitors for Improving the Performance of Manufacturing Systems.pdf        153.75 KB
    │ │ │   Simulation and Animation of Power Electronics and Drives,Requirements for Education.pdf        1.00 MB
    │ │ │   Simulation and Modeling of the Effect of Substrate Conductivity on Coupling Inductance and Circuit Crosstalk.pdf        311.18 KB
    │ │ │   SIMULATION BASED CAUSE AND EFFECT ANALYSIS IN SEMICONDUCTOR WAFER FABRICATION.pdf        176.77 KB
    │ │ │   Simulation Interoperability Across Parallel DEVS Models Ex-pressed in Multiple Programming Languages.pdf        81.43 KB
    │ │ │   SIMULATION OF CURRENT FILAMENTS IN PHOTOCONDUCTIVE SEMICONDUCTOR SWITCHES.pdf        125.71 KB
    │ │ │   Simulation of Self-Heating and Temperature Effect in GaN-based Metal-Semiconductor Field-Effect Transistor.PDF        203.66 KB
    │ │ │   simulation of semiconductor devices using a galerkin spherical harmonic expansion approach to solving the coupled poisson-boltzmann system.pdf        1.14 MB
    │ │ │   Simulation of semiconductor mode-locked ring lasers with monolithically integrated passive pulse shaping elements.pdf        112.23 KB
    │ │ │   Simulation of Semiconductor Nanostructures.pdf        249.10 KB
    │ │ │   Simulation of Submicronmeter Metal–Semiconductor–Metal Ultraviolet Photodiodes on Gallium Nitride.pdf        224.43 KB
    │ │ │   Simulation of terahertz generation at semiconductor surfaces.pdf        140.98 KB
    │ │ │   Simulation-Based Approach for Semiconductor Fab-Level Decision Making - Implementation Issues.pdf        257.28 KB
    │ │ │   Solder Joint Reliability Model with Modified Darveaux’s Equations for the micro SMD Wafer Level-Chip Scale Package Family.pdf        434.46 KB
    │ │ │   SPATIAL VARIATION IN SEMICONDUCTOR PROCESSES MODELING FOR CONTROL.pdf        1.53 MB
    │ │ │   Spectral Element Modeling of Semiconductor Heterostructures.pdf        476.71 KB
    │ │ │   Spin Readout and Initialization in a Semiconductor Quantum Dot.pdf        277.73 KB
    │ │ │   Streamlined Circuit Device Model Development with f REEDATMand ADOL-C.pdf        135.99 KB
    │ │ │   Teaching Electronics with MATLAB.pdf        18.84 KB
    │ │ │   The new approach to the power semiconductor devices modeling.pdf        103.56 KB
    │ │ │   THERMAL AND SENSITIVITY ANALYSIS OF MULTI-FIN DEVICES.pdf        184.70 KB
    │ │ │   Towards Tbps wavelength conversion with a bulk semiconductor optical amplifier.pdf        185.93 KB
    │ │ │   Transient Modeling of Ferroelectric Capacitors for Semiconductor Memories.pdf        88.15 KB
    │ │ │   Translating IBIS Files to Simulator Specific Model Formats.pdf        92.84 KB
    │ │ │   Tuning Mechanism for a MEMS External Cavity Laser.pdf        313.36 KB
    │ │ │   Two-Dimensional Numerical Simulations of a Solid State Maxwell Demon.pdf        87.37 KB
    │ │ │   Using a Hybrid Approach to Evaluate Semiconductor Life Cycle Environmental Issues.pdf        1.39 MB
    │ │ │   Using Continuation Methods for Modeling Nanoscale Semiconductor Devices.pdf        37.37 KB
    │ │ ├─可靠性        (0 folders, 32 files, 12.74 MB, 12.74 MB in total.)
    │ │ │   2006 IEEE International Integrated Reliability Workshop.pdf        239.45 KB
    │ │ │   Capabilites and Reliability of LEDs and Laser Diodes.pdf        25.19 KB
    │ │ │   ESD Reliability Challenges for RFMixed Signal Design & Processing.pdf        74.40 KB
    │ │ │   Evaluating the Performance and Reliability of Embedded Computer Systems for Use in Industrial and Automotive Temperature Ranges.pdf        284.16 KB
    │ │ │   Evaluating the Performance and Reliability of Embedded Computer Systems for Use in Industrial and Automotive Temperature Ranges2.pdf        203.80 KB
    │ │ │   Failure Analysis and Reliability Improvement.pdf        3.47 MB
    │ │ │   High Power, High Reliability Quantum Cascade Lasers at the Center for Quantum Devices.pdf        72.21 KB
    │ │ │   High-Speed Event and Defect Detection with Real-Time Response.pdf        116.71 KB
    │ │ │   HIGH-TEMPERATURE RELIABILITY OF GaN ELECTRONIC devices.pdf        153.90 KB
    │ │ │   iEEE-INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM.pdf        1.79 MB
    │ │ │   IMPROVING FAB PERFORMANCE BY UPGRADING THE RELIABILITY OF YOUR CRITICAL CONTROL AND LIFE SAFETY SYSTEMS.pdf        163.13 KB
    │ │ │   Lattice Semiconductor Product Reliability Report.pdf        94.03 KB
    │ │ │   Long Term Reliability of Spring Pin Pressure Contacts in an Industrial Environment.pdf        1.83 MB
    │ │ │   Organic semiconductor (TCNQ complex salt) type OS-CON (16SH33M).pdf        112.90 KB
    │ │ │   Outstanding Issues in Compound Semiconductor Reliability.pdf        84.34 KB
    │ │ │   Power Module Reliability.pdf        58.22 KB
    │ │ │   Prognostic Techniques for Semiconductor Failure Modes.pdf        125.42 KB
    │ │ │   Quality mission of Fairchild Semiconductor Corporation.pdf        11.41 KB
    │ │ │   Quantum Dot Applications for Flash Memory, Semiconductor Lasers, and Photodetectors.pdf        175.44 KB
    │ │ │   Reliability and Qualification of IIIV Semiconductor Devices for Space Applications.pdf        129.65 KB
    │ │ │   Reliability Design Technology for Power Semiconductor Modules.pdf        59.01 KB
    │ │ │   Reliability of Electronic Packages and Semiconductor Devices.pdf        8.06 KB
    │ │ │   Reliability of Integrated Circuits and Semiconductor Devices.pdf        208.39 KB
    │ │ │   RELIABILITY TESTS AND RELIABILITY PREDICTION.pdf        366.54 KB
    │ │ │   Selected Topics on Reliability Design for Micro and Nano Electronics.pdf        882.34 KB
    │ │ │   SEMICONDUCTOR DEVICE RELIABILITY.pdf        121.07 KB
    │ │ │   Semiconductor High Volume Manufacturing Process Variability, Material, Environmental and Defect Reliability.pdf        4.90 KB
    │ │ │   Semiconductor Reliability Quality and Reliability-.pdf        659.25 KB
    │ │ │   System Reliability Testing RF Devices for Modern Communications.pdf        19.03 KB
    │ │ │   The reliablity of semiconductor RAM memories with on-chip error-correction coding.pdf        0.98 MB
    │ │ │   Transitioning to Lead(Pb)-Free Manufacturing with Toshiba Semiconductor Products.pdf        191.27 KB
    │ │ │   Utility Reliability Metrics for New E conomy Processes.pdf        140.72 KB
    │ │ ├─热仿真        (0 folders, 35 files, 22.02 MB, 22.02 MB in total.)
    │ │ │   Analysis of thermally enhanced SOIC packages.pdf        1.64 MB
    │ │ │   Analysis of thermally-enhanced SOIC packages.pdf        920.26 KB
    │ │ │   Asymptotic thermal analysis of electronic packages and printed-circuit boards.pdf        693.13 KB
    │ │ │   Design and Performance of a System for VLSI Packaging Thermal Modeling and Characterization.pdf        1.35 MB
    │ │ │   EFFICIENT THERMAL SIMULATION FOR RUN-TIME TEMPERATURE TRACKING AND MANAGEMENT.pdf        176.26 KB
    │ │ │   Electro-Thermo-Fluidic Simulation of a complete IGBT modules Packaging Application to the Transient State Simulation of a Low Frequency PWM-VSI.pdf        0.99 MB
    │ │ │   Finite Element Modeling Predicts Possibility of Thermoelectrically-Cooled Lead-Salt Diode Lasers.pdf        47.99 KB
    │ │ │   Modeling a MEMS Thermal Conductivity Pressure Sensor for the Evaluation of Glass Frit Vacuum Packaging.pdf        332.49 KB
    │ │ │   Rapid thermal chemical vapor deposition of zirconium oxide for metal-oxide-semiconductor field effect transistor application.pdf        402.09 KB
    │ │ │   System in a Package Solution for DC-DC Converters David Bolognia, Senior Product Manager.pdf        2.52 MB
    │ │ │   Thermal analysis of integrated circuit devices and packages.pdf        886.58 KB
    │ │ │   Thermal and Structural Analysis of the TPX Divertor.pdf        49.21 KB
    │ │ │   Thermal Characterization and Board Level Modeling of the RSLIC18 in the MLFP Package.pdf        350.89 KB
    │ │ │   Thermal effects in monolithically integrated tunable laser transmittersl.pdf        1.60 MB
    │ │ │   Thermal enhancement of IC packages.pdf        1.00 MB
    │ │ │   Thermal enhancement of plastic IC packages.pdf        1.12 MB
    │ │ │   Thermal Management of High Power Memory Module.pdf        353.97 KB
    │ │ │   Thermal Measurement Methodology of RF Power Amplifiers.pdf        248.58 KB
    │ │ │   Thermal measurements of active semiconductor micro-structures acquired through the substrate using near IR thermoreflectance.pdf        465.75 KB
    │ │ │   Thermal Modeling and Imaging of As-built Vehicle Components.pdf        461.09 KB
    │ │ │   Thermal Modeling of Aluminum Electrolytic Capacitors.pdf        102.95 KB
    │ │ │   Thermal Modeling of Cryogenic Accelerator Structures.pdf        309.75 KB
    │ │ │   Thermal Modeling of Power-electronic Systems.pdf        402.01 KB
    │ │ │   Thermal Modeling, Analysis and Management in VLSI Circuits Principles and Methods.pdf        252.58 KB
    │ │ │   Thermal Modeling, Characterization and Management of On-chip Networks.pdf        798.16 KB
    │ │ │   Thermal Profiling Locating the Onset of Gain Saturation in Semiconductor Optical Amplifiers.pdf        146.66 KB
    │ │ │   Thermal Profiling of Gain Saturation in Semiconductor Optical Amplifiers.pdf        28.57 KB
    │ │ │   Thermal Simulation of a Unique Ultra-Thin Semiconductor Packaging Architecture fo Improved Power Dissipation.pdf        1.37 MB
    │ │ │   Thermal Simulation of a Unique Ultra-Thin Semiconductor Packaging Architecture for Improved Power Dissipation.pdf        99.24 KB
    │ │ │   Thermal transient characterization methodology for single-die and stacked structures.pdf        342.36 KB
    │ │ │   THERMAL-RESISTANCE OF IC Package.pdf        119.92 KB
    │ │ │   Thermo-Electric Characterization of APCVD PolySi07 Ge03 for IC-Compatible Fabrication of Integrated Lateral Peltier Elements.pdf        1.36 MB
    │ │ │   Thermomechanical Optical Attenuator.pdf        574.50 KB
    │ │ │   Transient thermal analysis of an ACF package assembly process.pdf        378.67 KB
    │ │ │   Transient two-dimensional thermal analysis of electronic packages by the boundary element method.pdf        356.75 KB
    │ │ ├─外文        (0 folders, 164 files, 77.88 MB, 77.88 MB in total.)
    │ │ │   2.11. Semiconductor thermodynamics.pdf        57.49 KB
    │ │ │   3.15 Electrical, Optical, and Magnetic Materials and Devices.pdf        386.72 KB
    │ │ │   A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP).pdf        439.05 KB
    │ │ │   A Dynamic Thermal Management Circuit for System-On-Chip Designs.pdf        137.40 KB
    │ │ │   A NEW STRUCTURAL MATERIAL BY ARCHITECTURAL DEMAND.pdf        154.74 KB
    │ │ │   a practical and reliable method for detection of nanosecond intermittency.pdf        1.53 MB
    │ │ │   A SIMPLIFIED CFD MODEL FOR THE RADIAL BLOWE.pdf        375.20 KB
    │ │ │   Accelerate Interconnect reliability Test.pdf        469.48 KB
    │ │ │   Adaptive Chip-Package Thermal Analysis for Synthesis and Design.pdf        394.81 KB
    │ │ │   Advanced ElectroThermal modeling of large power IGBTs.pdf        365.36 KB
    │ │ │   Advanced Process Control for Semiconductor Thermal Process.pdf        82.30 KB
    │ │ │   Advanced Thermal Processing of Semiconductor Materials by Flash Lamp Annealing.PDF        163.02 KB
    │ │ │   Advanced Thermal Processing of Semiconductor Materials by Flash Lamp Annealing2.pdf        77.05 KB
    │ │ │   advanced_power_electronics_thermal_mgmt.pdf        254.96 KB
    │ │ │   An Introduction to the Thermal Modelling and Characterisation of Semiconductor Bolometers.pdf        283.87 KB
    │ │ │   An Investigation of Thermal Enhancement of MPM BGA Package.pdf        502.99 KB
    │ │ │   ANALYSIS AND TESTING OF GRAPHITEEPOXY CONCRETE BRIDGE UNDER STATIC LOAD.pdf        865.00 KB
    │ │ │   analysis of thermal transient data with synthesized dynamic models for semiconductor devices.pdf        402.43 KB
    │ │ │   ANALYTICAL MODELING OF THERMAL RESISTANCE IN BOLTED JOINTS.pdf        267.93 KB
  • heusxg (2006-12-14 14:40:28)

    │ │ │   anand 模型的获得.pdf        351.89 KB
    │ │ │   anand 中文模型获得 现行拟合.pdf        146.41 KB
    │ │ │   anand2 model.pdf        369.83 KB
    │ │ │   Application of thermoacoustic engines to heat transfer in microcircuits.pdf        191.18 KB
    │ │ │   ATOMIC FORCE MICROSOPY ON SEMICONDUCTOR QUANTUM-DOT STRUCTURES FOR USE WITH QUANTUM INFORMATION PROCESSING.pdf        3.28 MB
    │ │ │   Bendable GaAs metal-semiconductor field-effect transistors formed with printed GaAs wire arrays on plastic substrates.pdf        340.78 KB
    │ │ │   BMI Resins as Low-Stress Alternatives to Epoxies for Semiconductor Package Assembly.pdf        220.46 KB
    │ │ │   Bonding pad resistance. A combined approach..pdf        365.33 KB
    │ │ │   CAD Computer-Aided Design Tools.pdf        81.37 KB
    │ │ │   CAD-based Methods for Thermal Modeling of Coolant Loops and Heat Pipes.pdf        187.80 KB
    │ │ │   CAE tool for opt. dev. of switched mode power supplies.pdf        157.07 KB
    │ │ │   calculation_of_semiconductor_failure_rates.pdf        15.29 KB
    │ │ │   Cellular Nonlinear Network Based on Semiconductor Tunneling Nanostructure.pdf        417.76 KB
    │ │ │   CHAPTER 2 RELIABILITY OF SEMICONDUCTORs.pdf        128.88 KB
    │ │ │   CHAPTER 3 FREE EDGE STRESS GRADIENT ZONES.pdf        278.39 KB
    │ │ │   Chapter 3. Step Structures on Semiconductor Surfaces.pdf        132.35 KB
    │ │ │   CHAPTER 5 MICRO-STRESS FIELD ANALYSIS.pdf        614.41 KB
    │ │ │   Characterization of Advanced Semiconductor Materials by Thermal Desorption Mass Spectrometry with Atmospheric Pressure Ionization.pdf        69.27 KB
    │ │ │   Chip-scale networks Power and thermal impact.pdf        288.01 KB
    │ │ │   Choosing The Right Power MOSFET Package.pdf        154.10 KB
    │ │ │   Close the Information Gap on IC package Reliability 1.pdf        29.97 KB
    │ │ │   Combined electrical and optical heating in thermal wave microscopy of semiconductor devices.pdf        1.85 MB
    │ │ │   Compact Electro-thermal Model of Semiconductor Device with Nonlinear Convection Coefficient.pdf        704.64 KB
    │ │ │   COMPONENT SIZE AND EFFECTIVE THERMAL CONDUCTIVITY OF PRINTED CIRCUIT BOARDS.pdf        571.92 KB
    │ │ │   Comprehensive Model Heat transfer.pdf        269.23 KB
    │ │ │   Compressive and Tensile Stress in CdSe Semiconductor Quantum Dots.pdf        291.55 KB
    │ │ │   COMPUTATION FOR MICROMACHINE DESIGN.pdf        381.48 KB
    │ │ │   Connector Reliability Testing.pdf        828.17 KB
    │ │ │   Contactless Characterization of Silicon Wafers.pdf        560.67 KB
    │ │ │   Converting to Lead-Free Surface Plating for Terminals for Semiconductor Packages.pdf        434.99 KB
    │ │ │   Coupled Electro-Thermo-Optical 3D Simulation of Edge-Emitting Lasers.pdf        312.52 KB
    │ │ │   Coupled Electro-Thermo-Optical Simulation of a Multisection DBR Laser.pdf        1.23 MB
    │ │ │   CSC REPORT ON SCIENTIFIC COMPUTING 2001–2003.pdf        3.14 MB
    │ │ │   Data Remanence in Semiconductor Devices.pdf        1.15 MB
    │ │ │   DESIGN OPTIMIZATION OF AN EDDY CURRENT SENSOR USING THE FINITE-ELEMENTS METHOD.pdf        261.84 KB
    │ │ │   Designs for Thin-Film-Coated Semiconductor Thermal Neutron Detectors.pdf        467.08 KB
    │ │ │   Detection of Infrared Photons Using the Electronic Stress in Metal-Semiconductor Interfaces.pdf        556.06 KB
    │ │ │   DEVELOPMENT OF A DRY WALL CONCEPT FOR LASER IFE CHAMBERS.pdf        257.23 KB
    │ │ │   Development of a New Improved High Performance Flip Chip BGA Package.pdf        673.35 KB
    │ │ │   DEVELOPMENT OF SiCN CERAMIC THERMAL ACTUATORS.pdf        234.51 KB
    │ │ │   DROP TEST AND IMPACT LIFE PREDICTION MODEL FOR QFN PACKAGES.pdf        420.79 KB
    │ │ │   Dynamic Thermal Characterization and Modeling of Packaged AlGaAsGaAs HBT’s.pdf        173.23 KB
    │ │ │   Efects of stress annealing on the electrical and the optical properties of MOS devices.pdf        539.95 KB
    │ │ │   EFFECT OF RESIDUAL STRESS IN LAYERS OF ARTICULAR CARTILAGE UNDER DYNAMIC LOADING.pdf        297.89 KB
    │ │ │   Effect of Shear Stress and the Influence of Different Pump Methods on CMP Slurry.pdf        143.09 KB
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    │ │ │   Electrical and thermal modeling of the non-Ohmic differential conductance in a tunnel junction containing a pinhole.pdf        105.37 KB
    │ │ │   ELECTROCHEMICAL MECHANICAL DEPOSITION (ECMD) TECHNIQUE FOR SEMICONDUCTOR INTERCONNECT APPLICATIONS.pdf        490.58 KB
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    │ │ │   Evaluation of Airflow Prediction Methods in Compact Electronic Enclosures.pdf        118.63 KB
    │ │ │   Experimental and Theoretical Investigation of Thermal Performance of Heat Sinks.pdf        401.84 KB
    │ │ │   Experimental Techniques for Measuring Temperature and Velocity Fields to Improve the Use and Validation of Building Heat Transfer Models.pdf        563.42 KB
    │ │ │   Experimental Validation Methods for Thermal Models.pdf        673.24 KB
    │ │ │   FABRICATION AND ANALYSIS OF PLASTIC HYPODERMIC NEEDLES.pdf        458.08 KB
    │ │ │   Fan Swirl Effects on Cooling Heat Sinks and Electronic Packages.pdf        109.47 KB
    │ │ │   Fatigue Crack Initiation Life Prediction for a Flat Plate with a center hole.pdf        201.22 KB
    │ │ │   Fatigue of reinforced-polyurethane-based, sheet metal forming dies.pdf        336.39 KB
    │ │ │   Film stress vernus plating rate for pulse-plated gold.pdf        43.50 KB
    │ │ │   Fully Analytical Compact Thermal Model of Complex Electronic Power Devices and Packages in Coupled Electrothermal CAD.pdf        919.84 KB
    │ │ │   GLASS-COATED MELT SPINNING FABRICATION TECHNOLOGY AND SOME PHYSICAL PROPERTIES OF Bi2Te3 MICROWIRES.pdf        228.32 KB
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    │ │ │   High Resolution Backside Imaging and Thermography using a Numerical Aperture Increasing Lens.pdf        502.85 KB
    │ │ │   High spatial resolution subsurface thermal emission microscopy.pdf        116.95 KB
    │ │ │   High Temperature Lead (Pb)-free Solder Bumping on Low Stress Bond Pads.pdf        142.02 KB
    │ │ │   Hot-carrier thermal conductivity from the simulation of submicron semiconductor structures.pdf        100.80 KB
    │ │ │   IC Packaging and Input - Output Signals.pdf        1.55 MB
    │ │ │   Improving accuracy in heat flux measurements.doc        69.00 KB
    │ │ │   Influence of strain on semiconductor thin film epitaxy.pdf        635.08 KB
    │ │ │   Investigation of Electrode Material Mechanics.pdf        2.53 MB
    │ │ │   investigation of solder fatigue acceleration factors.pdf        668.67 KB
    │ │ │   Lead Bending and Soldering Considerations for International Rectifier’s Power Semiconductor Packages .pdf        104.72 KB
    │ │ │   Lead Bending and Soldering Considerations for International Rectifier’s Power Semiconductor Packages.pdf        104.72 KB
    │ │ │   MEASURING THE FORCES DURING THE MECHANICAL VERTICAL MANIPULATION OF SINGLE ATOMS AT SEMICONDUCTOR SURFACES.pdf        554.24 KB
    │ │ │   Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages.pdf        138.30 KB
    │ │ │   Mechanical modelling of wood microstructure, an engineering approach.pdf        371.50 KB
    │ │ │   Mechanical-Stress-Controlled Silicide Interconnections for Highly Reliable Semiconductor Devices.PDF        182.04 KB
    │ │ │   Micron-Scale Strain Determination in III-V Semiconductor Devices by Computer Simulation and X-ray Diffraction.pdf        350.68 KB
    │ │ │   microsystems-technology-standardisation-roadmap.pdf        1.36 MB
    │ │ │   Nano Engineered Fire Resistant Composite Fibers.pdf        1.16 MB
    │ │ │   NONLINEAR FINITE ELEMENT ANALYSIS OF RESIDUAL STRESSES IN SEMICONDUCTOR EPILAYERS.pdf        2.21 MB
    │ │ │   Numerical characterization of functionally graded active materials under electrical and thermal fields.pdf        472.73 KB
    │ │ │   Observation of Coupled Vibrational Modes of a Semiconductor Nanocrystal.pdf        103.54 KB
    │ │ │   On the modeling of lattice thermal conductivity in semiconductor quantum dot superlattices.pdf        176.02 KB
    │ │ │   Origin of microwave noise from an n-channel metal–oxide–semiconductor field effect transistor.pdf        74.64 KB
    │ │ │   PA CKA GE DEALS.pdf        142.95 KB
    │ │ │   Package Thermal Characterization Package Thermal Characterization.pdf        184.11 KB
    │ │ │   PACKAGE_THERMAL_CHARACTERIZATION-MISC.pdf        78.54 KB
    │ │ │   Packaging considerations of an Integrated Inverter Module (IIM) for Hybrid Vehicles.pdf        4.01 MB
    │ │ │   PARAMETRIC THERMAL MODELING OF 3D STACKED CHIP ELECTRONICS WITH INTERLEAVED SOLID HEAT SPREADERS.pdf        59.77 KB
    │ │ │   PCB-integrated metallic thermal micro-actuators.pdf        364.16 KB
    │ │ │   Philips Semiconductors TDA8002C_3.pdf        149.68 KB
    │ │ │   Photoinduced and thermal stress in silicon microcantilevers.pdf        73.77 KB
    │ │ │   Physically Rigorous Modeling of Sensing Techniques Exploiting the ThermoOptical and Electro Optical Effect.pdf        116.02 KB
    │ │ │   Physically-Based Compact Thermal Modeling — Achieving Parametrization and Boundary Condition Independence.pdf        266.22 KB
    │ │ │   PLASTIC_PACKAGE_MOISTURE-INDUCED_CRACKING.pdf        478.36 KB
    │ │ │   Prediction of Microelectronics Thermal Behavior in Electronic Equipment Status, Challenges and Future Requirements.pdf        384.72 KB
    │ │ │   Pressure Effects in AlGaAsGaAs RTDs for application in semiconductor sensors.pdf        44.46 KB
    │ │ │   Prospect of Si Semiconductor Devices in Nanometer Era.pdf        66.88 KB
    │ │ │   PZFlex_Capabilities—FEM packages.pdf        416.62 KB
    │ │ │   Quantum Effects in Thermal and Thermo-Electric Transport in Semiconductor Nanostructures.pdf        570.84 KB
    │ │ │   RAPID, LOW-COST FABRICATION OF PARYLENE MICROCHANNELS FOR MICROFLUIDIC APPLICATIONS.pdf        1.41 MB
    │ │ │   Recent Advancement in the Thermal Design of Electric Motors.pdf        2.81 MB
    │ │ │   REDUCED HUMAN FATIGUE INTERACTIVE EVOLUTIONARY COMPUTATION FOR MICROMACHINE DESIGN.pdf        809.26 KB
    │ │ │   Reduction of Voltage Stresses in Buck-Boost-Type Power Factor Correctors Operating in Boundary Conduction Mode.pdf        176.24 KB
    │ │ │   REFINED STRENGTH AND LIFE ANALYSIS OF FRP BEAMS.pdf        323.35 KB
    │ │ │   RELIABILITY ANALYSIS OF BGA PACKAGES – A TOOL FOR DESIGN ENGINEERS.pdf        440.01 KB
    │ │ │   Reliability Modelling of Embedded System-in-a-Package.pdf        569.43 KB
    │ │ │   reliability of lead-force solder materials for ic packaging.pdf        664.19 KB
    │ │ │   Resonant thermal transport in semiconductor barrier structures.pdf        118.65 KB
    │ │ │   semiconductor device thermal testing.doc        79.00 KB
    │ │ │   Semiconductor Electrochemistry and Localised Corrosion.pdf        132.16 KB
    │ │ │   SEMICONDUCTOR ELECTROCHEMISTRY APPROACH TO PASSIVITY AND STRESS CORROSION CRACKING SUSCEPTIBILITY OF STAINLESS STEELS.pdf        29.87 KB
    │ │ │   Semiconductor IC Packaging Technology Challenges.pdf        230.53 KB
    │ │ │   Semiconductor Package Synthetic Models Provide.ppt        1.13 MB
    │ │ │   Semiconductor Packaging Technologies for Miniaturization and High Pin Count.pdf        181.41 KB
    │ │ │   Semiconductor Surface Studies.pdf        947.91 KB
    │ │ │   Sensitivity Evaluation on Sphere Attachment Shear Strength.pdf        146.31 KB
    │ │ │   SiC rapid thermal carbonization of the (111)Si semiconductor-on-insulator structure and subsequent metalorganic chemical vapor deposition of GaN.pdf        77.94 KB
    │ │ │   Solder Joint Design For Reliability.pdf        150.71 KB
    │ │ │   Spherical deformation of compliant substrates with semiconductor device islands.pdf        244.98 KB
    │ │ │   StreamlinedThermal Modeling.pdf        66.41 KB
    │ │ │   Stress and magnetic properties of FeGaAs(001).pdf        99.22 KB
    │ │ │   Stress and Strain Measurements in Semiconductor Device Channel Areas by Convergent Beam Electron Diffraction.PDF        1.43 MB
    │ │ │   Stress-induced polymer waveguides operating at both 1.31 and 1.55 lm wavelengths.pdf        236.33 KB
    │ │ │   Sub-micron metallic electrothermal actuators.pdf        1.42 MB
    │ │ │   Surface Engineering of Polycrystalline Silicon Microelectromechanical Systems for Fatigue Resistance.PDF        443.31 KB
    │ │ │   TEMPERATURE DEPENDENT MODEL OF ION SELECTIVE TRANSISTOR FOR MULTIDOMAIN SIMULATIONS.pdf        242.84 KB
    │ │ │   Temperature Induced Stress of ZnSe Quantum Dots in Glass Matrix Thin Films Grown by Pulsed Laser Deposition.pdf        136.39 KB
    │ │ │   The Engineering, Design, and Fabrication Facility A Unique APL Resource.pdf        1.24 MB
    │ │ │   The Need for a FullChip Thermally Optimized IC Designs.pdf        1.03 MB
    │ │ │   thermal design consideration for luxeon 5 watt power light source.pdf        405.74 KB
    │ │ │   Thermal Design Considerations—EL75XX.pdf        194.66 KB
    │ │ │   Thermal Modeling of Microgravity Experiments.pdf        398.50 KB
    │ │ │   Time Dependent Behaviour of Piezo-Electric Materials.pdf        358.35 KB
    │ │ │   TOWARDS UNDERGRADUATE EDUCATION IN SYSTEMS HARDWARE TECHNOLOGIES.pdf        138.51 KB
    │ │ │   Toxic effects of the semiconductor metal gallium on common carp (Cyprinus carpio).pdf        503.01 KB
    │ │ │   tsop.pdf        245.80 KB
    │ │ │   Using Kinetic Models to Predict Thermal Degradation of Fire-Retardant-Treated Plywood Roof Sheathing.pdf        241.56 KB
    │ │ │   Using Thermal Profiling to Quantify Optical Feedback into Semiconductor Lasers.pdf        207.94 KB
    │ │ │   Wafer level hermetic package and device testing of a SOI-MEMS switch for biomedical applications.pdf        433.35 KB
    │ │ │   多晶片模組可靠性及可繞性擺置法之研究.pdf        64.95 KB
    │ │ │   复合材料结构弹脆塑性力学行为数值研究.pdf        168.00 KB
    │ │ │   散熱分析對BGA 封裝模型可靠度的影響.pdf        43.74 KB
    │ │ └─中文        (0 folders, 84 files, 39.60 MB, 39.60 MB in total.)
    │ │     Bumpless Build-UpLayer 封装.pdf        484.72 KB
    │ │     circuit_design19.pdf        146.66 KB
    │ │     CMOS-MEMS 製程技術與電腦輔助微機電系統設計.pdf        6.63 MB
    │ │     FC-PBGA 之熱流模擬簡介.pdf        1.60 MB
    │ │     IC 智能卡失效机理研究.pdf        191.07 KB
    │ │     Icepak 薄板元件在IC 封裝上的新應用.pdf        367.38 KB
    │ │     ILB TCP Thermal-mechanical analysis_IM.pdf        2.96 MB
    │ │     LED China.pdf        1.09 MB
    │ │     LED论文集.pdf        1.81 MB
    │ │     MEMS封装可靠性测试规范.pdf        154.21 KB
    │ │     NUMERICAL MODELING OF A SLUSHFLOW EVENT.pdf        386.88 KB
    │ │     Package Thermal Characteristics.pdf        65.72 KB
    │ │     Parameterized Physical Compact Thermal Modeling.pdf        428.97 KB
    │ │     PCB 焊点可靠性问题的理论和实验研究进展.pdf        179.53 KB
    │ │     PCB焊点可靠性问题的理论和实验研究进.pdf        179.53 KB
    │ │     Polymer-MEMS 及其微流體生醫晶片之應用.pdf        1.34 MB
    │ │     RTP公司的高性能熱塑性塑膠.pdf        261.56 KB
    │ │     SL 快速成型件变形的等效力学模型分析.pdf        91.40 KB
    │ │     對偶邊界元素法在疲勞破壞之工程應用.pdf        185.08 KB
    │ │     應用準確白光相移技術於BGA 共平面之檢測.pdf        13.71 KB
    │ │     應用不同影像量化法於電子構裝熱變形量測之系統設計.pdf        262.47 KB
    │ │     “封装工艺员”课程详细介绍.pdf        94.62 KB
    │ │     板厚影响通孔再流焊点抗热疲劳性能的.pdf        125.91 KB
    │ │     板类构件内部残余应力测试技术研究.pdf        135.78 KB
    │ │     表面粗糙度对于微结构粘附的影响分析.pdf        198.84 KB
    │ │     冰箱试验包传热过程的仿真计算.pdf        120.22 KB
    │ │     彩色機器視覺在BGA 鍍金區瑕疵偵測與分類上的應用.pdf        415.31 KB
    │ │     单板层积材热效应的表征.pdf        114.14 KB
    │ │     倒装焊sn_pb焊点的热疲劳失效.pdf        211.60 KB
    │ │     第12組_轉注成型電子封裝.pdf        656.37 KB
    │ │     典型的密封式电子设备结构热设计研究.CAJ        41.33 KB
    │ │     电子电气用工程塑料应用发展趋势.pdf        92.81 KB
    │ │     电子封装功率模块PbSnAg 焊层热循环可靠性.pdf        141.01 KB
    │ │     电子封装和组装中的微连接技术.pdf        129.41 KB
    │ │     电子封装和组装中的微连接技术0.pdf        129.41 KB
    │ │     电子封装失效分析技术.pdf        1.03 MB
    │ │     多道焊三维残余应力场有限元模拟.pdf        281.27 KB
    │ │     非对称压电层合板的热效应.pdf        195.87 KB
    │ │     覆晶式塑封球柵陣列熱系統分析.pdf        530.00 KB
    │ │     复杂环境下的三维疲劳断裂.pdf        242.70 KB
    │ │     钢渗硼表面残余应力数值模拟.pdf        221.81 KB
    │ │     高密度多重埋孔印制板的设计与制造.pdf        221.49 KB
    │ │     高密度封装温度研究.pdf        140.67 KB
    │ │     高温SiC基电子组件的封装.pdf        44.57 KB
    │ │     各向异性导电胶粘接可靠性研究进展s.pdf        87.73 KB
    │ │     国内外无铅焊料专利发展概况.pdf        398.36 KB
    │ │     含埋藏裂纹焊接结构可靠性分析.pdf        47.34 KB
    │ │     混合封装电力电子集成模块内的传热研究.pdf        121.24 KB
    │ │     混凝土鋪面版之角隅荷重與翹曲應力分析.pdf        68.19 KB
    │ │     基于ANSYS软件二次开发的铸造充型和凝固耦合过程数值模拟研究.caj        48.99 KB
    │ │     基于ANSYS上的焊接热过程模拟技术的研究.caj        35.50 KB
    │ │     基于全面析因试验的塑封球栅阵列器件焊点可靠性.pdf        239.50 KB
    │ │     集成式计算机芯片水冷系统的研究.pdf        158.31 KB
    │ │     網路攝影機外殼之製程最佳化.pdf        360.36 KB
    │ │     晶元封裝三維有限分析.pdf        276.47 KB
    │ │     颗粒增强基复合材料屈服行为研究.pdf        240.06 KB
    │ │     铝合金点焊过程中电极振动信号的AR建模与研究.pdf        252.62 KB
    │ │     软性基板之封装可靠性.pdf        1.01 MB
    │ │     散热能力.pdf        628.82 KB
    │ │     使用自動模組化元件來產生IC 封裝模型.pdf        21.98 KB
    │ │     塑料封装器件塑料界面分层失效分析.pdf        115.87 KB
    │ │     通孔元件再流焊点的抗热疲劳性能预测(Ⅰ).pdf        598.55 KB
    │ │     通孔元件再流焊点的抗热疲劳性能预测(Ⅱ).pdf        757.71 KB
    │ │     微电子封装互连焊点的可靠性.pdf        886.47 KB
    │ │     微电子封装与组装中的再流焊技术研究进展.pdf        151.49 KB
    │ │     微电子无铅锡焊可靠性.pdf        242.41 KB
    │ │     无铅焊可靠性.pdf        1.03 MB
    │ │     无铅化挑战的电子组装与封装时代.pdf        130.62 KB
    │ │     无线技术中堆栈裸芯封装.pdf        108.34 KB
    │ │     吸水过程对环氧树脂的动态松弛行为的影响.pdf        192.38 KB
    │ │     先進微電子封裝中錫銀銅銲料與金鎳表面處理層之界面反應.pdf        1.56 MB
    │ │     芯片叠层封装的失效分析和热应力模拟.pdf        139.63 KB
    │ │     芯片验证测试及失效分析1.pdf        243.56 KB
    │ │     新式堆疊封裝結構之熱傳模擬分析.rar        100.50 KB
    │ │     压渗SiCp Al 电子封装复合材料的研究.pdf        605.85 KB
    │ │     以電漿聚合技術對電子構裝軟性基板改質於表面及界面性質影響之研究.pdf        146.05 KB
    │ │     印刷電路板產業現況與展望.pdf        563.96 KB
    │ │     应用异方形导电胶与电子构装热行为分析.pdf        256.97 KB
    │ │     智能结构系统——梦想、现实与未来.pdf        374.91 KB
    │ │     邊界元素法分析電子構裝之層面熱應力.pdf        1.13 MB
    │ │     電子業之環保策略.pdf        319.18 KB
    │ │     電子構裝熱音波銲接金線製程研究.pdf        427.80 KB
    │ │     電子構裝中重要性漸起的IC載板產業.pdf        106.35 KB
    │ │     電子散熱及系統熱源管理.pdf        1.47 MB
  • heusxg (2006-12-14 14:40:56)

    │ ├─软件教程        (11 folders, 33 files, 25.05 MB, 225.59 MB in total.)
    │ │ │ ADS微带天线设计.pdf        1.15 MB
    │ │ │ [经典]Modeling the fatigue crack growth and propagation life of a joint.pdf        393.81 KB
    │ │ │ Advanced Design System2005a_whats_new.pdf        1.07 MB
    │ │ │ ANSYS FAQs.pdf        337.80 KB
    │ │ │ ansys mpc.pdf        276.68 KB
    │ │ │ ansys8.1并行计算指南.pdf        536.59 KB
    │ │ │ Ansys_线性和非线性结构静力分析指南.pdf        1.36 MB
    │ │ │ ANSYS_优化设计.pdf        262.64 KB
    │ │ │ ANSYS帮助中疲劳一章的翻译.pdf        235.39 KB
    │ │ │ ansys处理粘结问题.rar        139.65 KB
    │ │ │ ANSYS分析实例与工程应用.rar        97.35 KB
    │ │ │ ANSYS基于VC++6[1].0的二次开发与相互作用分析在ANSYS中的实现.rar        10.96 KB
    │ │ │ ANSYS接触元素之使用与验证.rar        190.48 KB
    │ │ │ ANSYS梁单元的理论基础及其选用方法.PDF        186.14 KB
    │ │ │ ANSYS命令整理.rar        230.93 KB
    │ │ │ ANSYS优化设计.rar        1.23 MB
    │ │ │ ansys中文教程.rar        1.32 MB
    │ │ │ Flotherm51帮助文件.rar        1.92 MB
    │ │ │ HIERARCHICAL MODULAR MODELLING IN DISCRETE SIMULATION.pdf        196.20 KB
    │ │ │ MATLABI与ANSYS的连接.pdf        148.21 KB
    │ │ │ MPICH 并行程序设计环境简介h.pdf        484.75 KB
    │ │ │ NASTRAN温度场分析资料.rar        187.48 KB
    │ │ │ patran技巧及其常见问题 Patran FAQs and TIPs.pdf        176.93 KB
    │ │ │ ProE高级曲面.pdf        606.30 KB
    │ │ │ ProE野火入门.pdf        4.14 MB
    │ │ │ 电磁学名词.rar        20.03 KB
    │ │ │ 经理主管决策人员需要知道的有限元素分析.pdf        31.25 KB
    │ │ │ 疲劳分析中的雨流计数法.pdf        109.79 KB
    │ │ │ 数学公式的英语读法.pdf        83.00 KB
    │ │ │ 特性阻抗之诠释与测试.rar        8.99 KB
    │ │ │ 微機電設計模擬軟體Coventorware Introduction.PDF        2.49 MB
    │ │ │ 有限元的单位.pdf        182.68 KB
    │ │ │ 有限元分析讲义.chm        5.34 MB
    │ │ ├─ANSOFT        (0 folders, 7 files, 2.24 MB, 2.24 MB in total.)
    │ │ │   Ansoft高级培训班教材.rar        269.49 KB
    │ │ │   bldcmotoranalysisbymaxwlell2d.rar        364.84 KB
    │ │ │   HFSS8.0中文培训教程.rar        556.13 KB
    │ │ │   HFSS仿真耦合器.rar        689.47 KB
    │ │ │   HFSS使用经验.rar        139.37 KB
    │ │ │   HFSS使用心得.rar        17.06 KB
    │ │ │   一个法国牛人的射频培训资料.rar        253.64 KB
    │ │ ├─ANSYS Solutions        (0 folders, 14 files, 5.98 MB, 5.98 MB in total.)
    │ │ │   Electronic Packaging -ANSYS.pdf        57.25 KB
    │ │ │   ansys-ptd.pdf        240.79 KB
    │ │ │   cfx-transition-mod.pdf        452.65 KB
    │ │ │   electromagnetics-solution-10.pdf        217.47 KB
    │ │ │   electronics-industry.pdf        531.44 KB
    │ │ │   ion-dynamics.pdf        206.15 KB
    │ │ │   mems-solutions-1.pdf        919.24 KB
    │ │ │   microsystems and Nanotechnology-spotlight-sum05.pdf        170.76 KB
    │ │ │   multiphysics-solution-10.pdf        219.89 KB
    │ │ │   multiphysics_analysis.pdf        426.56 KB
    │ │ │   semiconductor analysis-spotlight-win06.pdf        0.96 MB
    │ │ │   tools for mems.pdf        329.07 KB
    │ │ │   wp_eaton.pdf        88.39 KB
    │ │ │   wp_ews.pdf        1.24 MB
    │ │ ├─ANSYS Thermal        (1 folders, 3 files, 6.45 MB, 18.88 MB in total.)
    │ │ │ │ Qb热分析[120'].rar        1.78 MB
    │ │ │ │ 热分析完整PPT.rar        4.28 MB
    │ │ │ │ 热应力.pdf        402.24 KB
    │ │ │ └─PTD&TAS Manual        (0 folders, 3 files, 12.43 MB, 12.43 MB in total.)
    │ │ │     PTDUsersManual10.rar        3.86 MB
    │ │ │     TASPCBUsersManual10.rar        4.50 MB
    │ │ │     TASUsersManual10.rar        4.08 MB
    │ │ ├─Ansys单元库        (16 folders, 0 files, 0 bytes, 13.04 MB in total.)
    │ │ │ ├─超单元        (0 folders, 4 files, 1.04 MB, 1.04 MB in total.)
    │ │ │ │   HYPER56.pdf        253.32 KB
    │ │ │ │   HYPER74.pdf        256.24 KB
    │ │ │ │   HYPER84.pdf        268.71 KB
    │ │ │ │   HYPER86.pdf        284.77 KB
    │ │ │ ├─弹簧单元        (0 folders, 2 files, 325.81 KB, 325.81 KB in total.)
    │ │ │ │   COMBIN14.pdf        226.39 KB
    │ │ │ │   COMBIN39.pdf        99.42 KB
    │ │ │ ├─杆单元        (0 folders, 7 files, 1.16 MB, 1.16 MB in total.)
    │ │ │ │   LINK1.pdf        174.81 KB
    │ │ │ │   LINK10.pdf        199.72 KB
    │ │ │ │   Link11.pdf        149.68 KB
    │ │ │ │   LINK180.pdf        182.75 KB
    │ │ │ │   LINK32.pdf        130.52 KB
    │ │ │ │   LINK33.pdf        153.22 KB
    │ │ │ │   LINK8.pdf        192.21 KB
    │ │ │ ├─管单元        (0 folders, 1 files, 234.57 KB, 234.57 KB in total.)
    │ │ │ │   PIPE 16.pdf        234.57 KB
    │ │ │ ├─接触单元        (0 folders, 1 files, 226.33 KB, 226.33 KB in total.)
    │ │ │ │   CONTA48.pdf        226.33 KB
    │ │ │ ├─矩阵单元        (0 folders, 1 files, 116.89 KB, 116.89 KB in total.)
    │ │ │ │   MATRIX27.pdf        116.89 KB
    │ │ │ ├─壳单元        (0 folders, 7 files, 1.48 MB, 1.48 MB in total.)
    │ │ │ │   SHELL41.doc        97.50 KB
    │ │ │ │   shell 181.pdf        160.26 KB
    │ │ │ │   Shell 51.pdf        178.37 KB
    │ │ │ │   shell163.pdf        159.56 KB
    │ │ │ │   Shell43.doc        165.50 KB
    │ │ │ │   Shell63.pdf        233.23 KB
    │ │ │ │   Solid 191.pdf        518.88 KB
    │ │ │ ├─梁单元        (0 folders, 5 files, 1.12 MB, 1.12 MB in total.)
    │ │ │ │   BEAM54.pdf        324.30 KB
    │ │ │ │   Beam188.pdf        242.83 KB
    │ │ │ │   beam189.pdf        74.83 KB
    │ │ │ │   Beam3.pdf        245.80 KB
    │ │ │ │   Beam4.pdf        259.34 KB
    │ │ │ ├─流体单元        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
    │ │ │ ├─平面单元        (0 folders, 20 files, 3.64 MB, 3.64 MB in total.)
    │ │ │ │   PLANE121.pdf        188.61 KB
    │ │ │ │   PLANE13.pdf        221.53 KB
    │ │ │ │   PLANE145.pdf        181.38 KB
    │ │ │ │   PLANE146.pdf        174.37 KB
    │ │ │ │   PLANE162.pdf        174.82 KB
    │ │ │ │   PLANE182.pdf        205.11 KB
    │ │ │ │   PLANE183.pdf        206.25 KB
    │ │ │ │   PLANE2.pdf        118.38 KB
    │ │ │ │   PLANE223.pdf        180.69 KB
    │ │ │ │   PLANE25.pdf        203.13 KB
    │ │ │ │   PLANE35.pdf        192.21 KB
    │ │ │ │   PLANE42.pdf        213.74 KB
    │ │ │ │   PLANE53.pdf        234.36 KB
    │ │ │ │   PLANE55.pdf        185.59 KB
    │ │ │ │   PLANE67.pdf        186.18 KB
    │ │ │ │   PLANE75.pdf        181.49 KB
    │ │ │ │   PLANE77.pdf        181.37 KB
    │ │ │ │   PLANE78.pdf        184.68 KB
    │ │ │ │   PLANE82.pdf        127.77 KB
    │ │ │ │   PLANE83.pdf        183.24 KB
    │ │ │ ├─三维单元        (0 folders, 11 files, 1.25 MB, 1.25 MB in total.)
    │ │ │ │   SOLID164.pdf        85.49 KB
    │ │ │ │   Solid185.pdf        143.12 KB
    │ │ │ │   Solid186.pdf        145.01 KB
    │ │ │ │   Solid187.pdf        128.75 KB
    │ │ │ │   solid45.pdf        67.42 KB
    │ │ │ │   Solid46.pdf        78.66 KB
    │ │ │ │   SOLID5.pdf        103.83 KB
    │ │ │ │   SOLID64.pdf        103.37 KB
    │ │ │ │   SOLID65.pdf        136.89 KB
    │ │ │ │   SOLID92.pdf        149.99 KB
    │ │ │ │   SOLID95.pdf        141.41 KB
    │ │ │ ├─无质量单元        (0 folders, 1 files, 94.71 KB, 94.71 KB in total.)
    │ │ │ │   Mesh200.pdf        94.71 KB
    │ │ │ ├─预应力单元        (0 folders, 1 files, 99.86 KB, 99.86 KB in total.)
    │ │ │ │   PRETS179.pdf        99.86 KB
    │ │ │ ├─杂项        (0 folders, 4 files, 1.90 MB, 1.90 MB in total.)
    │ │ │ │   ansys比较完整的单元.chm        1.17 MB
    │ │ │ │   ansys单元翻译.chm        589.50 KB
    │ │ │ │   常见单元及其特性.DOC        152.50 KB
    │ │ │ │   基本讲述.txt        11.58 KB
    │ │ │ ├─粘塑单元        (0 folders, 3 files, 342.34 KB, 342.34 KB in total.)
    │ │ │ │   VISCO106.pdf        112.32 KB
    │ │ │ │   VISCO107.pdf        117.10 KB
    │ │ │ │   VISCO108.pdf        112.93 KB
    │ │ │ └─质量单元        (1 folders, 2 files, 45.69 KB, 54.00 KB in total.)
    │ │ │   │ MASS166.doc        34.00 KB
    │ │ │   │ MASS21.htm        11.69 KB
    │ │ │   └─MASS21.files        (0 folders, 5 files, 8.31 KB, 8.31 KB in total.)
    │ │ │       ansysdoc.css        870 bytes
    │ │ │       contents.gif        1.99 KB
    │ │ │       copyright.gif        1.86 KB
    │ │ │       gELEM21-1.gif        2.05 KB
    │ │ │       up.gif        1.56 KB
    │ │ ├─ansys专题教程        (0 folders, 9 files, 21.86 MB, 21.86 MB in total.)
    │ │ │   ANSYS电磁场.rar        6.63 MB
    │ │ │   ANSYS优化设计.rar        1.23 MB
    │ │ │   Workshop.rar        1.05 MB
    │ │ │   动力学.rar        2.76 MB
    │ │ │   几个例子.rar        853.77 KB
    │ │ │   其他.rar        1.99 MB
    │ │ │   热传导.rar        2.89 MB
    │ │ │   热分析.rar        4.37 MB
    │ │ │   耦合场.rar        101.26 KB
    │ │ ├─Excel        (0 folders, 5 files, 2.05 MB, 2.05 MB in total.)
    │ │ │   Excel办公自动化.rar        273.10 KB
    │ │ │   Excel的资料库管理.rar        745.12 KB
    │ │ │   Excel试验数据处理.rar        376.60 KB
    │ │ │   Excel在回归分析中的应用.rar        315.50 KB
    │ │ │   excel在统计学中的应用.rar        390.99 KB
    │ │ ├─Flotherm        (0 folders, 2 files, 5.01 MB, 5.01 MB in total.)
    │ │ │   Flotherm51帮助文件.rar        1.92 MB
    │ │ │   flotherm_short_tutorialv42.rar        3.10 MB
    │ │ ├─Icepak        (0 folders, 3 files, 4.16 MB, 4.16 MB in total.)
    │ │ │   Icepak实例详解(中文).rar        934.16 KB
    │ │ │   icepak-4.1.16-upgrade-training.rar        2.43 MB
    │ │ │   Model building icepak-04-objects.rar        842.28 KB
    │ │ ├─Matlab        (6 folders, 0 files, 0 bytes, 65.52 MB in total.)
    │ │ │ ├─编程        (0 folders, 7 files, 8.61 MB, 8.61 MB in total.)
    │ │ │ │   MATLAB 程式设计与应用.rar        20.83 KB
    │ │ │ │   d2 Matlab语言编程.rar        112.69 KB
    │ │ │ │   MATLAB 图像处理命令.rar        417.43 KB
    │ │ │ │   MATLAB常用函数参考.rar        226.98 KB
    │ │ │ │   matlab工具箱函数汇总.rar        43.13 KB
    │ │ │ │   MATLAB应用程序接口用户指南.rar        7.80 MB
    │ │ │ │   基本MATLAB指令介紹 (I).rar        6.73 KB
    │ │ │ ├─基础        (0 folders, 11 files, 1.73 MB, 1.73 MB in total.)
    │ │ │ │   MATLAB 簡介.rar        172.13 KB
    │ │ │ │   Matlab符号数学工具箱应用简介.rar        74.76 KB
    │ │ │ │   MATLAB基础知识.rar        544.57 KB
    │ │ │ │   Matlab偏微分方程工具箱应用简介.rar        48.74 KB
    │ │ │ │   MATLAB入门.rar        272.83 KB
    │ │ │ │   MATLAB入门教程.rar        122.85 KB
    │ │ │ │   MATLAB入門講義.rar        51.65 KB
    │ │ │ │   Matlab神经网络工具箱应用简介.rar        238.96 KB
    │ │ │ │   MATLAB语言简介.rar        72.77 KB
    │ │ │ │   软件使用练习-MATLAB篇.rar        41.79 KB
    │ │ │ │   上机辅导讲义.rar        131.72 KB
    │ │ │ ├─论文        (0 folders, 13 files, 2.04 MB, 2.04 MB in total.)
    │ │ │ │   MATLAB 图形用户界面环境下的实时控制系统.rar        138.67 KB
    │ │ │ │   Maflab语言与线性电路的符号仿真.rar        120.59 KB
    │ │ │ │   MATLAB 与PSpice 的数据接口技术.rar        255.81 KB
    │ │ │ │   Matlab动力学仿真.rar        288.50 KB
    │ │ │ │   MATLAB数字信号处理实例.rar        168.82 KB
    │ │ │ │   MATLAB语言在天线设计中的运用.rar        123.05 KB
    │ │ │ │   基于MATLAB 串口通信的数据采集系统的设计.rar        280.33 KB
    │ │ │ │   基于MATLAB的控制理论CAI软件的 设计与应用.rar        60.55 KB
    │ │ │ │   基于Matlab的数据处理与三维模拟.rar        60.99 KB
    │ │ │ │   利用Ansoft软件和Matlab构建无线系统通用仿真平台.rar        91.71 KB
    │ │ │ │   特殊電機即時控制與磁場分析學習平台之研製.rar        330.56 KB
    │ │ │ │   应用MATLAB研究双层隔振系统.rar        155.61 KB
    │ │ │ │   在MATLAB捕捉F1等热键.rar        18.72 KB
    │ │ │ ├─书籍        (0 folders, 10 files, 44.97 MB, 44.97 MB in total.)
    │ │ │ │   MATLAB 6[1].0科学运算完整解决方案.rar        13.23 MB
    │ │ │ │   MATLAB 的使用 陳明凱 編撰1.rar        273.47 KB
    │ │ │ │   MATLAB 的使用.rar        1.35 MB
    │ │ │ │   matlab-中文帮助.rar        0.98 MB
    │ │ │ │   MATLAB图形技术——绘图及图形用户接口.rar        6.21 MB
    │ │ │ │   MATLAB与科学计算  (第2版)-1.rar        5.11 MB
    │ │ │ │   MATLAB语言与自动控制系统设计.rar        1.97 MB
    │ │ │ │   MATLAB中文教程.rar        3.16 MB
    │ │ │ │   反馈控制系统设计与分析_10901033.rar        5.95 MB
    │ │ │ │   基于MATLAB_Simulink的系统仿真技术与应用_10822743.rar        6.74 MB
    │ │ │ ├─数学        (0 folders, 8 files, 7.63 MB, 7.63 MB in total.)
    │ │ │ │   EXCEL的统计规划功能.rar        6.93 MB
    │ │ │ │   Matlab关于微分方程的解法.rar        195.71 KB
    │ │ │ │   Matlab软件用于统计分析教学.rar        22.23 KB
    │ │ │ │   Matlab在复变函数中应用.rar        97.00 KB
    │ │ │ │   Matlab在微积分中的应用.rar        27.47 KB
    │ │ │ │   附录二 Matlab在线性代数中的应用.rar        112.64 KB
    │ │ │ │   数学建模初步与MATLAB等工具软件简介.rar        208.73 KB
    │ │ │ │   随机系统模拟.rar        57.69 KB
    │ │ │ └─算法        (0 folders, 4 files, 544.44 KB, 544.44 KB in total.)
    │ │ │     MATLAB6.0优化问题.rar        187.81 KB
    │ │ │     蚂蚁算法.rar        36.46 KB
    │ │ │     数字水印.rar        53.43 KB
    │ │ │     先进算法讲义.rar        266.74 KB
    │ │ ├─Moldflow        (0 folders, 27 files, 57.92 MB, 57.92 MB in total.)
    │ │ │   ABAQUS-MOLDFLOW接口.rar        1.49 MB
    │ │ │   Gas Assisted Injection Molding.rar        902.59 KB
    │ │ │   HyperMesh 7.0Moldflow Interface Tutorials.rar        2.01 MB
    │ │ │   Moldflow Design Guide-Content.rar        123.56 KB
    │ │ │   Moldflow5手册.rar        1.83 MB
    │ │ │   moldflowPPT教程.rar        13.18 MB
    │ │ │   Moldflow公司材料.rar        1.08 MB
    │ │ │   Moldflow公司出的塑件设计原理.rar        1.80 MB
    │ │ │   MOLDFLOW简明入门.rar        4.22 KB
    │ │ │   MOLDFLOW教程.rar        4.99 MB
    │ │ │   MOLDFLOW解释结果.rar        23.06 KB
    │ │ │   MoldFlow冷却分析.rar        1.28 MB
    │ │ │   Moldflow流动分析.rar        462.15 KB
    │ │ │   MoldFlow翘曲分析.rar        1.18 MB
    │ │ │   MoldFlow软件冷却分析及应用.rar        174.69 KB
    │ │ │   MoldFlow软件翘曲分析及应用.rar        458.72 KB
    │ │ │   MoldFlow软件应力分析及应用.rar        155.45 KB
    │ │ │   MoldFlow软件优化模具型腔尺寸.rar        165.79 KB
    │ │ │   MoldFlow软件优化注塑工艺参数应用.rar        164.99 KB
    │ │ │   MoldFlow软件在注塑模具设计中的应用-论文集.rar        2.10 MB
    │ │ │   Moldflow卫道培训.rar        18.46 MB
    │ │ │   moldflow系列讲座.rar        1.84 MB
    │ │ │   moldfow_design_principles.rar        1.86 MB
    │ │ │   MPI Injection Compression分析.rar        25.42 KB
    │ │ │   MPI 使用.rar        1.85 MB
    │ │ │   跨世纪的MOLDFLOW.rar        147.78 KB
    │ │ │   模流分析教程说明.rar        243.86 KB
    │ │ └─网格技术        (0 folders, 5 files, 3.88 MB, 3.88 MB in total.)
    │ │     Patran相贯划分网格教程.pdf        2.11 MB
    │ │     hypermesh5_day1.pdf        576.70 KB
    │ │     hypermesh5_day2.pdf        848.14 KB
    │ │     金属塑性成形有限元六面体网格自动生成方法及优化技术.pdf        219.25 KB
    │ │     六面体单元生成方法及相关技术.pdf        168.96 KB
    │ ├─散热设计        (1 folders, 29 files, 8.52 MB, 24.51 MB in total.)
    │ │ │ Advanced Thermal Architecture for Cooling of High Power Electronics.rar        228.83 KB
    │ │ │ Cooling of Power Switching Semiconductor Devices.rar        467.51 KB
    │ │ │ Icepak在电子设备热设计中的应用概述.rar        266.07 KB
    │ │ │ IGBT-06-散热设计方法.rar        467.94 KB
    │ │ │ Innovative heatsink Enables hot uplinkls.rar        171.86 KB
    │ │ │ mcm热设计方法.rar        8.58 KB
    │ │ │ PACKAGE_THERMAL_CHARACTERIZATION-MISC.rar        62.78 KB
    │ │ │ pc散热综述.rar        11.34 KB
    │ │ │ Performing Thermal Analysis in System.rar        1.34 MB
    │ │ │ SMT印制电路板热设计探讨.rar        8.93 KB
    │ │ │ The following discussion is a brief introduction to the technical fundamentals of semiconductor device thermal testing using the electrical method of junction temperature measurement.rar        61.54 KB
    │ │ │ The Improvement of Thermal Modeling Accuracy of Electronic Packages.rar        306.52 KB
    │ │ │ Thermal Characterization and Board Level Modeling of the RSLIC18 in the MLFP Package.rar        341.05 KB
    │ │ │ Thermal Characterization of Packaged.rar        141.35 KB
    │ │ │ UNDERSTANDING_INTERGRATED_CIRCUIT_PACKAGE_POWER_CA.rar        159.22 KB
    │ │ │ Why Is My DC-DC Converter Too Hot.rar        1.65 MB
    │ │ │ 應用Icepak於TBGA封裝之熱設計可靠度分析之研究.rar        737.37 KB
    │ │ │ 熱傳導係數測定實驗.rar        70.34 KB
    │ │ │ 表面组装器件热设计.rar        8.12 KB
    │ │ │ 大功率半导体器件主要参数介绍.rar        161.75 KB
    │ │ │ 大功率电源模块的散热设计.rar        44.23 KB
    │ │ │ 电子产品的热设计方法.rar        22.50 KB
    │ │ │ 电子元器件自然对流散热器的设计探讨.rar        316.93 KB
    │ │ │ 封装散热技术.rar        501.79 KB
    │ │ │ 开关电源设计步骤.rar        27.81 KB
    │ │ │ 冷板散热问题的数值模拟.rar        412.49 KB
    │ │ │ 如何计算散热器的散热功率.rar        70.71 KB
    │ │ │ 手機等電子產品的熱設計方法.rar        17.12 KB
    │ │ │ 電子元件散熱片研究規劃.rar        571.44 KB
    │ │ └─Flotherm设计应用        (0 folders, 27 files, 15.99 MB, 15.99 MB in total.)
    │ │     FLOTHERM 和T3Ster帮助Imbera开发新的集成模块板(IMB) 技术.pdf        800.59 KB
    │ │     Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications.pdf        800.77 KB
    │ │     冲击式散热器热性能的数值研究 - 散热片形状优化.pdf        255.00 KB
    │ │     电子器件设计的多物性建模.pdf        634.93 KB
    │ │     电子系统的热设计方法 - 板级和器件级.pdf        621.59 KB
    │ │     对标准TQFP封装的热评估.pdf        634.82 KB
    │ │     对等离子显示屏的冷却分析.pdf        98.98 KB
    │ │     对一个PBGA封装中的GaAs MMIC器件基于设计的热性能评估.pdf        749.32 KB
    │ │     对一个强大的PC620多处理器计算机的热评估.pdf        785.33 KB
    │ │     对一种Therma-Base散热器的CFD建模.pdf        446.45 KB
    │ │     高性能 体积比的CPU的冷却设计.pdf        208.68 KB
    │ │     高性能低成本的芯片封装-μBGA的设计特性.pdf        1.23 MB
    │ │     建模分析温度对产品可靠性的影响.pdf        1.06 MB
    │ │     冷却器件的建模.pdf        125.74 KB
    │ │     埋地电阻器的热模型和埋地器件的设计指导.pdf        470.39 KB
    │ │     器件级v板级热分析的CFD建模:用于低速气流冷却的PBGA连接技术.pdf        654.36 KB
    │ │     热管辅助散热器的分析.pdf        300.82 KB
    │ │     使用简单的温度测量来验证CPGA 散热器组件的CFD模型从而优化散热器性能1.pdf        635.66 KB
    │ │     数值计算工具对通信系统内印刷电路板热评估的应用.pdf        583.61 KB
    │ │     微冷却在高密度存储模块中的应用.pdf        545.43 KB
    │ │     一个长形置顶微处理器基本单元的热模型.pdf        0.98 MB
    │ │     应用于汽车设备的PBGA单封装技术热性能的参数化研究.pdf        800.77 KB
    │ │     应用于掌上通信的MAP PBGA 封装的热估算和功能增强.pdf        188.02 KB
    │ │     用于PA8000处理器的小型化高效冷却设备的系统级热建模.pdf        1.35 MB
    │ │     用于Tape Carrier封装中奔腾处理器的散热器设计的热分析.pdf        274.92 KB
    │ │     在系统环境中的高速DDR设备的热性能.pdf        678.63 KB
    │ │     置于表面的散热器的热分析.pdf        354.18 KB
    │ ├─数理基础        (0 folders, 21 files, 22.08 MB, 22.08 MB in total.)
    │ │   CSP封裝產品在循環熱應力下之可靠度分析PPT.rar        658.70 KB
    │ │   LOC IC構裝之晶粒破裂分析PPT.rar        468.76 KB
    │ │   传  热.rar        1.18 MB
    │ │   弹  塑  性  力  学PPT.rar        858.25 KB
    │ │   导  热.rar        405.89 KB
    │ │   第三章 直梁的弯曲PPT.rar        1.65 MB
    │ │   电子封装力学PPT.rar        39.63 KB
    │ │   高聚物粘弹性力学模型中值得探讨的几个问题PPT.rar        245.41 KB
    │ │   固体力学概论PPT.rar        393.99 KB
    │ │   光电技术PPT.rar        4.14 MB
    │ │   宏观尺度材料设计 有限元方法PPT.rar        148.30 KB
    │ │   基于TigerSHARC的Rife算法的仿真实现.rar        409.10 KB
    │ │   金属的断裂PPT.rar        2.47 MB
    │ │   金属塑性加工原理PPT.rar        1.79 MB
    │ │   理论力学PPT.rar        1.11 MB
    │ │   流体力学.rar        0.99 MB
    │ │   流体力学PPT.rar        222.79 KB
    │ │   热力学统计力学PPT.rar        2.41 MB
    │ │   热流数值方法.rar        131.21 KB
    │ │   物理学PPT.rar        974.22 KB
    │ │   现代固体力学与材料PPT.rar        1.50 MB
  • heusxg (2006-12-14 14:41:17)

    │ ├─微波与天线        (1 folders, 39 files, 11.66 MB, 20.27 MB in total.)
    │ │ │ AnAnalysisof1-DSmoothedParticleHydrodynamicsKernels.pdf        649.79 KB
    │ │ │ 超分辨测向中阵元间互耦的校正.pdf        327.29 KB
    │ │ │ 大功率微带滤波器的设计.pdf        109.63 KB
    │ │ │ 带阻及低通微带滤波器的分析与设计.pdf        300.47 KB
    │ │ │ 电磁学名词.doc        110.00 KB
    │ │ │ 干扰合成孔径雷达的统一方程.pdf        750.86 KB
    │ │ │ 干扰条件下雷达探测距离的建模和分析.pdf        186.76 KB
    │ │ │ 合成孔径雷达的特点及其干扰技术.pdf        189.65 KB
    │ │ │ 基于FDTD的宽带微带天线的研究.pdf        545.37 KB
    │ │ │ 基于FDTD的微带缝隙漏波天线分析.pdf        461.90 KB
    │ │ │ 基于FDTD的相控微带天线阵设计与分析.pdf        164.97 KB
    │ │ │ 基于MEMS微带天线带宽和辐射特性的分析研究.pdf        333.49 KB
    │ │ │ 基于单次快拍的自适应天线阵互耦效应分析与校正.pdf        112.04 KB
    │ │ │ 机载有源相控阵天线的结构设计.pdf        195.95 KB
    │ │ │ 极化变换方法及其原理分析.pdf        464.64 KB
    │ │ │ 阶跃阻抗带通微带滤波器的设计仿真与优化.pdf        270.84 KB
    │ │ │ 雷达运动目标回波分析.doc        81.00 KB
    │ │ │ 利用ADS仿真设计低噪声放大器.pdf        756.76 KB
    │ │ │ 连续结构微带滤波器的矩阵运算法分析.pdf        234.53 KB
    │ │ │ 频率捷变雷达有源干扰技术仿真研究.pdf        500.74 KB
    │ │ │ 频谱分析仪——频域测量的最重要工具.pdf        225.16 KB
    │ │ │ 频谱分析仪测量调幅、调频.pdf        210.75 KB
    │ │ │ 频谱分析仪的原理和发展.pdf        95.36 KB
    │ │ │ 平行耦合微带滤波器设计与实现.pdf        262.53 KB
    │ │ │ 微波滤波器的回顾与展望.caj        824.32 KB
    │ │ │ 微波线形功率放大器综述.doc        115.00 KB
    │ │ │ 微波线性相位环状微带滤波器.pdf        131.21 KB
    │ │ │ 微波元器件测量的重要手段:网络分析仪.pdf        57.67 KB
    │ │ │ 微带电路和天线的时域仿真.pdf        726.16 KB
    │ │ │ 微带天线RCS及其减缩.pdf        189.67 KB
    │ │ │ 线性调频脉冲压缩雷达干扰仿真研究.pdf        252.68 KB
    │ │ │ 相控阵雷达的关键技术与物理学的波动知识.pdf        295.03 KB
    │ │ │ 相控阵雷达与光控相控阵雷达.pdf        633.14 KB
    │ │ │ 小型微带带通滤波器的设计.caj        137.67 KB
    │ │ │ 新型毫米波微带带通滤波器.caj        142.91 KB
    │ │ │ 一种EBG微带滤波器的设计.caj        385.46 KB
    │ │ │ 一种新型频率固定相控波束扫描的微带漏波天线.pdf        171.60 KB
    │ │ │ 智能天线微带天线阵列中线阵单元设计.pdf        145.73 KB
    │ │ │ 阻抗加载对微带天线辐射和散射的影响.pdf        191.23 KB
    │ │ └─IEEE论文        (0 folders, 28 files, 8.61 MB, 8.61 MB in total.)
    │ │     00029681.pdf        77.10 KB
    │ │     00094372.pdf        35.97 KB
    │ │     00098406.pdf        90.19 KB
    │ │     00115517.pdf        299.55 KB
    │ │     00134727.pdf        180.22 KB
    │ │     00175231.pdf        11.49 KB
    │ │     00407787.pdf        189.35 KB
    │ │     00407918.pdf        174.69 KB
    │ │     00407953.pdf        287.02 KB
    │ │     00549899.pdf        212.93 KB
    │ │     00630049.pdf        249.21 KB
    │ │     00662653.pdf        472.41 KB
    │ │     00698726.pdf        596.88 KB
    │ │     00789240.pdf        767.00 KB
    │ │     00873640.pdf        592.84 KB
    │ │     00874431.pdf        161.10 KB
    │ │     00959606.pdf        694.32 KB
    │ │     01016862.pdf        901.39 KB
    │ │     01182515.pdf        450.51 KB
    │ │     01217385.pdf        147.67 KB
    │ │     01219340.pdf        152.82 KB
    │ │     01256969.pdf        394.36 KB
    │ │     01330068.pdf        19.67 KB
    │ │     01330107.pdf        132.49 KB
    │ │     01353605.pdf        449.19 KB
    │ │     01440709.pdf        445.91 KB
    │ │     01460969.pdf        69.04 KB
    │ │     01552587.pdf        561.21 KB
    │ ├─信号完整性        (0 folders, 23 files, 14.14 MB, 14.14 MB in total.)
    │ │   PCB design flow.pdf        96.41 KB
    │ │   accurate_simulation_of_plastic_effects_within_packaged_microwave_devices.pdf        1.06 MB
    │ │   linux_wireless_net_adm3-17.pdf        174.35 KB
    │ │   PCB板的EMC问题.pdf        201.26 KB
    │ │   TDR 阻抗测量-信号完整性的基础.pdf        1.72 MB
    │ │   超深亚微米芯片互连线电感提取技术及应用.pdf        149.54 KB
    │ │   存储器接口设计-认识信号完整性的价值.pdf        203.86 KB
    │ │   高速PCB设计指南.pdf        889.15 KB
    │ │   高速PCB设计中的串扰分析与控制.pdf        181.86 KB
    │ │   高速數位電路之電源完整性.pdf        140.14 KB
    │ │   高速背板总线的组合式匹配方法.pdf        171.02 KB
    │ │   高速数字系统印刷电路板的设计要点.pdf        200.16 KB
    │ │   基于GTL 技术的高速背板总线设计.pdf        198.84 KB
    │ │   基于信号完整性分析的高速数字PCB 的设计方法.pdf        16.49 KB
    │ │   使用传输线矩阵法TLM对任意的槽结构建模.pdf        225.24 KB
    │ │   使用传输线矩阵法(TLM)建立的一个完全集成的复合半导体模型.pdf        260.96 KB
    │ │   数字设计人员验证信号完整性指南.pdf        3.81 MB
    │ │   无网格方法及其在电磁场数值计算中的应用.pdf        200.24 KB
    │ │   信号完整性.pdf        611.41 KB
    │ │   信号完整性分析.pdf        1.48 MB
    │ │   信号完整性和时序分析的模式变化.pdf        545.26 KB
    │ │   信号完整性与电源完整性的仿真分析与设计.pdf        741.47 KB
    │ │   用混合信号示波器调试嵌入式混合信号设计_3.pdf        0.98 MB
    │ └─学位论文        (20 folders, 0 files, 0 bytes, 255.30 MB in total.)
    │   ├─MEMS系统        (0 folders, 6 files, 7.80 MB, 7.80 MB in total.)
    │   │   Adaptive Error Control in Multi-Physical Thin-Structure MEMS FE-Simulation.pdf        505.26 KB
    │   │   Design_Fabrication_and_Modeling_of_Magnetic_Microelectromechanical_System_MEMS_Components.pdf        2.79 MB
    │   │   入口气体流速及压力对弯曲微流到之寿命影响.pdf        421.25 KB
    │   │   射频(RF) MEMS开关的模拟、制备和力学分析.pdf        2.03 MB
    │   │   微镜扭转-弯曲耦合变形静态特性分析.pdf        99.26 KB
    │   │   靜電式半球狀微聚焦調變鏡之設計分析与制作.pdf        1.98 MB
    │   ├─Reliability        (0 folders, 6 files, 8.93 MB, 8.93 MB in total.)
    │   │   Fault Types and Reliability Estimates in Permanent Magnet AC Motors.pdf        940.45 KB
    │   │   Fully Quantum Mechanical Description of Ultrashort Time Dynamics of Semiconductor Quantum Dots.pdf        2.45 MB
    │   │   Improving Quality in Semiconductor.pdf        465.56 KB
    │   │   PHYSICS-BASED RELIABLITY ASSESSMENT OF EMBEDDED PASSIVES.pdf        3.62 MB
    │   │   RELIABILITY-YIELD ALLOCATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS MODELING AND OPTIMIZATION.pdf        842.29 KB
    │   │   Semiconductor Reliability.pdf        682.71 KB
    │   ├─残余应力        (0 folders, 7 files, 22.57 MB, 22.57 MB in total.)
    │   │   IC 8L SOTSP导线架残余应力和回弹研究.pdf        4.58 MB
    │   │   IC封装塑胶残余应力理论与分析.pdf        4.14 MB
    │   │   ILB TCP Thermal-mechanical analysis_IM.pdf        2.96 MB
    │   │   PBTGF 射出成型製程最佳化及挫屈特性研究.pdf        2.21 MB
    │   │   應用CADCAECAM 技術於塑膠射出成型.pdf        6.01 MB
    │   │   建立在硅基板上的埋藏式高分子波导.pdf        488.67 KB
    │   │   轉注成型封裝材.pdf        2.19 MB
    │   ├─电热耦合        (0 folders, 4 files, 3.56 MB, 3.56 MB in total.)
    │   │   Automatic Generation of Compact Electro-Thermal Models for Semiconductor Devices.pdf        345.55 KB
    │   │   electro-thermal modeling of a powerelectronic moudule.pdf        2.22 MB
    │   │   MODELING OF ELECTRO-THERMAL-COMPLIANT MICROMECHANISMS.pdf        782.47 KB
    │   │   Thermo-Electric Performance of poly-Si0.7Ge0.3.PDF        241.22 KB
    │   ├─复合材料        (0 folders, 5 files, 18.36 MB, 18.36 MB in total.)
    │   │   A Predictive Methodology for  Delamination Growth in Laminated Composites Part II  Analysis, Applications, and Accuracy Assessment.pdf        5.24 MB
    │   │   Effects of Interlaminar Stress Gradients on Free Edge Delamination in Composite Laminates.pdf        6.37 MB
    │   │   Strength and Fatigue Life Prediction for a Composite Structural Beam.pdf        2.65 MB
    │   │   The Impact Response of Composite Materials Involved in Helicopter Vulnerability Assessment.pdf        1.20 MB
    │   │   复合材料静水挤压加工.pdf        2.89 MB
    │   ├─化学工程        (0 folders, 2 files, 2.58 MB, 2.58 MB in total.)
    │   │   含有烯基侧链的芳香族二胺及其衍生之聚硫亚胺的合成性质研究.pdf        1.36 MB
    │   │   热处理对聚炳烯晴中空纤维参透蒸发分离效能的研究.pdf        1.22 MB
    │   ├─建模优化        (0 folders, 13 files, 15.71 MB, 15.71 MB in total.)
    │   │   2D semiconductor device simulations by WENO-Boltzmann schemes efficiency, boundary conditions and comparison to Monte Carlo methods.pdf        712.25 KB
    │   │   Accurate FE-Simulation of Three-Dimensional Microstructures.pdf        2.45 MB
    │   │   Mathematical Modeling of Semiconductor Devices.pdf        784.76 KB
    │   │   Modeling of Optical Properties of Semiconductor Heterostructures.pdf        1.16 MB
    │   │   Nonequilibrium Model for Semiconductor Laser Simulation.pdf        1.75 MB
    │   │   REVIEW OF NOISE IN SEMICONDUCTOR DEVICES AND MODELING OF NOISE IN SURROUNDING GATE MOSFET.pdf        1.19 MB
    │   │   Semiconductor Modeling with Bondgraphs.pdf        594.21 KB
    │   │   Semiconductor Models Their Mathematical Study and Approximation.pdf        263.39 KB
    │   │   Semiconductor Power-Device Modeling.pdf        154.24 KB
    │   │   Simulation of Semiconductor Quantum Well Lasers using Gain Tables.pdf        2.32 MB
    │   │   Stokes问题的Mortar有限元方法.pdf        571.41 KB
    │   │   Two Carrier Semiconductor Device Models with Geometric Structure and Symmetry Properties.pdf        722.53 KB
    │   │   有限元耦合应力分析.pdf        3.13 MB
    │   ├─界面分层        (0 folders, 7 files, 19.29 MB, 19.29 MB in total.)
    │   │   A Predictive Methodology for Delamination Growth in Laminated Composites Part II  Analysis,Applications, and Accuracy.pdf        5.24 MB
    │   │   Failure Criteria and their Application to Visco-ElasticVisco-Plastic Materials.pdf        105.36 KB
    │   │   HIGH-CYCLE FATIGUE IN MICRON-SCALE STRUCTURAL FILMS OF POLYCRYSTALLINE SILICON A REACTION-LAYER FAILURE MECHANISM.pdf        7.11 MB
    │   │   Sensitivity Analysis of Interface Fatigue Crack Propagation in Elastic Composite Laminates.pdf        2.51 MB
    │   │   含缺口碳纤维-聚醚醚酮复合材料积层板之疲劳破坏研究.pdf        1.23 MB
    │   │   塑胶球栈阵列封装界面热机械特性研究.pdf        1.93 MB
    │   │   芯片封装之粘结力测试与分析.pdf        1.17 MB
    │   ├─经济管理        (0 folders, 10 files, 6.21 MB, 6.21 MB in total.)
    │   │   A Model Predictive Control Approach for Managing Semiconductor Manufacturing Supply Chains under Uncertainty.pdf        813.47 KB
    │   │   Endogenous Policy Reform Learning versus Flexibility in Industrial Policy Design for Open Economies.pdf        467.54 KB
    │   │   The Weakest Link Semiconductor Production Equipment, Linkages, and the Limits to International Trade.pdf        337.76 KB
    │   │   朝阳科技大学-应用6西格马方法改善涂装制造不良率.pdf        1.77 MB
    │   │   国立中山大学论文-微利时代半导体封装测试业的竞争策略.pdf        638.80 KB
    │   │   台灣半導體上、中、下游產業股價指數之連動性探討.pdf        329.23 KB
    │   │   台湾手机产业嵌入式软体需求与机会.pdf        528.26 KB
    │   │   芯片封装业核心能力构建模式.pdf        371.65 KB
    │   │   员工分红入股制度对高科技产业发展之影响.pdf        578.98 KB
    │   │   资源技术与产业-工业技术研究院模式分析.pdf        482.35 KB
    │   ├─疲劳强度        (0 folders, 5 files, 19.47 MB, 19.47 MB in total.)
    │   │   EFFECT OF INTERMETALLIC COMPOUNDS ON THERMOMECHANICAL RELIABILITY OF LEAD-FREE SOLDER INTERCONNECTS FOR FLIP-CHIPS.pdf        6.28 MB
    │   │   国立成功大学芯片封装论文[40].pdf        1.89 MB
    │   │   焊接接头疲劳寿命评估.pdf        7.85 MB
    │   │   晶片级封装之可靠性分析[47].pdf        1.63 MB
    │   │   数值模拟覆晶粒尺寸之疲劳可靠性问题[45].pdf        1.82 MB
    │   ├─破坏分析        (0 folders, 4 files, 9.74 MB, 9.74 MB in total.)
    │   │   Study of Interfacial Crack Propagation In Flip Chip Assemblies With Nano-Filled Underfill Materials_200508_phd.pdf        3.36 MB
    │   │   电子构装之破坏力学分析[54].pdf        1.73 MB
    │   │   光电二极体锡焊构装之IMC层应力分析.pdf        0.97 MB
    │   │   晶片层级界面之结合强度与破坏韧度.pdf        3.68 MB
    │   ├─翘曲分析        (0 folders, 10 files, 16.57 MB, 16.57 MB in total.)
    │   │   CFD与模流分析在薄式电子封装中的设计与分析.pdf        2.14 MB
    │   │   PBTGF 射出成型製程最佳化及挫屈特性研究.pdf        2.21 MB
    │   │   壁纸级加热翘曲及变形分析.pdf        1.15 MB
    │   │   覆晶封装之热应力与翘曲分析[50].pdf        1.77 MB
    │   │   覆晶在熱壓合製程中之結構分析及性能改善.pdf        3.06 MB
    │   │   光电二极管IMC层应力分析.pdf        0.97 MB
    │   │   台湾论文-湿度所引起的封装翘曲分析及测试.pdf        906.90 KB
    │   │   微型球栈阵列封装翘曲及热应力分析[41].pdf        1.29 MB
    │   │   芯片封装元件翘曲分析研究.pdf        2.82 MB
    │   │   電子構裝製程中複層基板熱彎曲變形之探討.pdf        280.14 KB
    │   ├─热弹力学        (0 folders, 6 files, 2.42 MB, 2.42 MB in total.)
    │   │   應用逆向估測法於二維熱彈性動態問題之研究.pdf        1.09 MB
    │   │   熱耦合非均勻彈性圓板之非線性動態管制方程式.pdf        97.82 KB
    │   │   冰温度膨胀力的有限元分析.pdf        236.86 KB
    │   │   机车刹车碟之热应力分析.pdf        365.31 KB
    │   │   结构陶瓷激光加工的热应力分析.pdf        160.31 KB
    │   │   热容激光器激光介质的热力学数值模拟.pdf        496.92 KB
    │   ├─散热设计        (0 folders, 13 files, 31.83 MB, 31.83 MB in total.)
    │   │   ADVANCED THERMAL PROCESSING OF SEMICONDUCTOR MATERIALS IN THE MSEC-RANGE.pdf        743.06 KB
    │   │   Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power ELECTRIC MODULES.pdf        3.16 MB
    │   │   DOUBLE-SIDED LIQUID COOLING FOR POWER.pdf        1.54 MB
    │   │   Investigation of Thermal Transport in Layered Sytems and Micro-structured Semiconductor Devices by Photothermal Techniques and Finite Element Simulations.pdf        2.11 MB
    │   │   thermal conductivity and specific heat.pdf        4.83 MB
    │   │   Thermal Management in Embedded Systems.pdf        386.57 KB
    │   │   Thermal Modeling and Management of Discrete Surface Mount Packages.pdf        813.26 KB
    │   │   Thermal Properties of Semiconductor Low-Dimensional Structures.pdf        169.74 KB
    │   │   薄式电子封装热-机械性能设计分析.pdf        2.91 MB
    │   │   国立成功大学论文(笔记本电脑散热设计研究).pdf        1.10 MB
    │   │   晶片用环形水冷器之研究.pdf        5.91 MB
    │   │   微型电脑系统的热流场分析与实验.pdf        7.60 MB
    │   │   柱形散热片几何尺寸影响热传性能研究.pdf        613.16 KB
    │   ├─射流技术        (0 folders, 3 files, 4.94 MB, 4.94 MB in total.)
    │   │   Modeling and Simulation of the Fluidic Controlled Self-Assembly of Micro Parts.pdf        2.61 MB
    │   │   Modeling, Simulation,and Experimentation of a Promising New Packaging Technology Parallel Fluidic Self-Assembly of microdevices.pdf        521.92 KB
    │   │   Modelling, Simulation and Experimentation of a Promising New Packaging Technology – Paralled Fluidic Self-Assembly of Micro Devices.pdf        1.82 MB
    │   ├─设备工艺        (0 folders, 7 files, 14.96 MB, 14.96 MB in total.)
    │   │   表面粘着型发光二极管取放机构的研究.pdf        1.42 MB
    │   │   封装制程设备.pdf        2.77 MB
    │   │   国立中山大学硕士论文-用于微型组装之微型机械手设计与分析.pdf        2.97 MB
    │   │   通用CAIp于基板设计对比.pdf        1.39 MB
    │   │   微流动元件制程.pdf        2.68 MB
    │   │   微型懸臂式探針卡.pdf        2.33 MB
    │   │   粘晶机系统整合与力量控制研究.pdf        1.41 MB
    │   ├─湿气扩散        (0 folders, 1 files, 1.35 MB, 1.35 MB in total.)
    │   │   effect of tempretrue and moistrue on durability of low cost flip chip on board assembles.pdf        1.35 MB
    │   ├─新型封装        (0 folders, 2 files, 9.71 MB, 9.71 MB in total.)
    │   │   ELECTROPLATED COMPLIANT HIGH-DENSITY INTERCONNECTS FOR NEXT-GENERATION MICROELECTRONIC PACKAGING.pdf        5.27 MB
    │   │   High Temperature SiC Embedded Chip Module (ECM) with Double-Sided Metallization Structure.pdf        4.44 MB
    │   ├─压电效应        (0 folders, 2 files, 3.28 MB, 3.28 MB in total.)
    │   │   三維壓電致動器微鏡子之設計與製作.pdf        2.02 MB
    │   │   压电效应的有限元分析及压电悬置控制方法的研究.pdf        1.26 MB
    │   └─制程工艺        (0 folders, 14 files, 36.03 MB, 36.03 MB in total.)
    │       Monitoring and Control of Semiconductor Manufacturing Using Acoustic Techniques.pdf        848.35 KB
    │       Processes and Characteristic Analysis of GaN MOS Structure.pdf        438.81 KB
    │       Sink - Stat Model.pdf        1.83 MB
    │       T性管液压成型自适应模拟.pdf        1.32 MB
    │       應用CADCAECAM 技術於塑膠射出成型.pdf        6.01 MB
    │       球栈阵列型构装模流暨热传性能研究.pdf        2.08 MB
    │       三位电脑辅助工程在模流分析中应用研究.pdf        4.67 MB
    │       芯片封裝製程之金線偏移與導線架偏移分析-.pdf        3.43 MB
    │       芯片封裝製程之金線偏移與導線架偏移分析.pdf        67.69 KB
    │       一种新型微流量计的设计、制备及力学分析.pdf        2.64 MB
    │       以混成玻璃材料制作单模态之埋藏光波导.pdf        650.52 KB
    │       中原大学硕士论文-IC制造中的模流分析与金线偏移.pdf        6.58 MB
    │       中原大学硕士论文-以天口方法改变IC封装制造之金线偏移.pdf        1.37 MB
    │       鎢酸鋯陶瓷之製作.pdf        4.14 MB
    └─upload        (5 folders, 2 files, 45.11 KB, 120.71 MB in total.)
      │ ===上传文件注意事项===.txt        59 bytes
      │ CA11.JPG        45.06 KB
      ├─+基础学习区        (5 folders, 0 files, 0 bytes, 247.13 KB in total.)
      │ ├─科学计算        (2 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ │ ├─Matlab        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ │ └─其他        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ ├─实验测试        (2 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ │ ├─可靠性试验        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ │ └─热特性试验        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ ├─数理科学        (4 folders, 0 files, 0 bytes, 247.13 KB in total.)
      │ │ ├─电磁理论        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ │ ├─计算方法        (0 folders, 2 files, 247.13 KB, 247.13 KB in total.)
      │ │ │   代数方程求解方法收敛速度比较及对算法健壮性的影响.pdf        128.68 KB
      │ │ │   一种求解不可压N-S方程的非结构化网格方法.pdf        118.45 KB
      │ │ ├─流体传热        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ │ └─数学力学        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ ├─新文件夹        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ └─专业知识        (2 folders, 0 files, 0 bytes, 0 bytes in total.)
      │   ├─电子封装        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │   └─专业外语        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      ├─+技术应用区        (7 folders, 0 files, 0 bytes, 1.75 MB in total.)
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      │ ├─机械可靠性        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ ├─其他技术        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ ├─散热设计        (0 folders, 1 files, 294.81 KB, 294.81 KB in total.)
      │ │   半导体霍尔器件热特性参数化分析.rar        294.81 KB
      │ ├─微机电MEMS        (0 folders, 2 files, 1.47 MB, 1.47 MB in total.)
      │ │   msm99_ansys_trans126.pdf        168.45 KB
      │ │   scanning.mirrors.bonding.process.JMEMS.pdf        1.30 MB
      │ ├─信号完整性        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      │ └─压电声学        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
      ├─+临时存放区        (2 folders, 1 files, 697.50 KB, 10.59 MB in total.)
      │ │ hall device thermal simulation.ppt        697.50 KB
      │ ├─package        (2 folders, 2 files, 378.91 KB, 5.47 MB in total.)
      │ │ │ New technology introduction.pdf        352.13 KB
      │ │ │ package classification.pdf        26.78 KB
      │ │ ├─diodes        (3 folders, 0 files, 0 bytes, 4.07 MB in total.)
      │ │ │ ├─PACKAGE OUTLINE        (0 folders, 7 files, 1.20 MB, 1.20 MB in total.)
      │ │ │ │   Diode  Structure  Outline.pdf        202.99 KB
      │ │ │ │   GLASS CASE PACKAGE OUTLINE.pdf        177.41 KB
      │ │ │ │   LS-31 PACKAGE OUTLINE.pdf        176.04 KB
      │ │ │ │   Melf Diode Structure Outline.pdf        196.83 KB
      │ │ │ │   SOD-123 PACKAGE OUTLINE.pdf        185.37 KB
      │ │ │ │   SOD-323 PACKAGE OUTLINE (for straight feet).pdf        147.71 KB
      │ │ │ │   SOT-23 PACKAGE OUTLINE.pdf        145.03 KB
      │ │ │ ├─packing        (0 folders, 9 files, 1.81 MB, 1.81 MB in total.)
      │ │ │ │   1A1 THUR 1A9.pdf        165.75 KB
      │ │ │ │   Packing Specification of 26mm Ammo Pack.pdf        167.46 KB
      │ │ │ │   Packing Specification of 52mm Ammo Pack.pdf        309.74 KB
      │ │ │ │   Packing Specification of 52mm Reel Pack.pdf        162.87 KB
      │ │ │ │   Reel Packaging (Axial Lead Diodes).pdf        184.22 KB
      │ │ │ │   REEL TAPING SPECIFICATIONS FOR.pdf        175.59 KB
      │ │ │ │   TAPE AND REEL SPECIFICATIONS.pdf        304.04 KB
      │ │ │ │   Tape Box Packaging (Axial Lead Diodes).pdf        163.01 KB
      │ │ │ │   Taping of SMD-Components.pdf        216.44 KB
      │ │ │ └─technical info        (0 folders, 1 files, 1.06 MB, 1.06 MB in total.)
      │ │ │     Chemical Composition of Diode products (Lead Free).pdf        1.06 MB
      │ │ └─transistor        (1 folders, 0 files, 0 bytes, 1.03 MB in total.)
      │ │   └─PACKAGE OUTLINE        (0 folders, 5 files, 1.03 MB, 1.03 MB in total.)
      │ │       TO-220 TRANSISTOR PACKAGE OUTLINE.pdf        303.86 KB
      │ │       sot-23 PACKAGE OUTLINE.pdf        176.92 KB
      │ │       TO-92 DEVICE PACKAGE OUTLINE.pdf        156.13 KB
      │ │       TO-92 Transistor Structure Outline.pdf        195.06 KB
      │ │       TO-92L TRANSISTOR PACKAGE OUTLINE.pdf        221.19 KB
      │ └─package style        (8 folders, 1 files, 231.36 KB, 4.44 MB in total.)
      │   │ PackageType-CN.jpg        231.36 KB
      │   ├─DIP series        (0 folders, 10 files, 1.00 MB, 1.00 MB in total.)
      │   │   (DIP14-1).jpg        68.85 KB
      │   │   (DIP16).jpg        124.72 KB
      │   │   (DIP16-1).jpg        72.78 KB
      │   │   (DIP18).jpg        84.40 KB
      │   │   (DIP20).jpg        94.04 KB
      │   │   (DIP24).jpg        86.73 KB
      │   │   (DIP28).jpg        86.43 KB
      │   │   (DIP40).jpg        154.54 KB
      │   │   (DIP42).jpg        165.84 KB
      │   │   (DIP8).jpg        87.45 KB
      │   ├─HSOP series        (0 folders, 1 files, 87.34 KB, 87.34 KB in total.)
      │   │   (HSOP28).jpg        87.34 KB
      │   ├─LQFP series        (0 folders, 1 files, 94.39 KB, 94.39 KB in total.)
      │   │   (LQFP64).jpg        94.39 KB
      │   ├─QFP series        (0 folders, 2 files, 213.06 KB, 213.06 KB in total.)
      │   │   (QFP44).jpg        104.74 KB
      │   │   (QFP52).jpg        108.32 KB
      │   ├─SDIP series        (0 folders, 3 files, 300.08 KB, 300.08 KB in total.)
      │   │   (SDIP24).jpg        95.65 KB
      │   │   (SDIP28).jpg        99.58 KB
      │   │   (SDIP30).jpg        104.85 KB
      │   ├─SIP series        (0 folders, 2 files, 273.22 KB, 273.22 KB in total.)
      │   │   (SIP8).jpg        175.22 KB
      │   │   (SIP9).jpg        98.00 KB
      │   ├─SOP series        (0 folders, 6 files, 1.52 MB, 1.52 MB in total.)
      │   │   (SOP16).jpg        129.67 KB
      │   │   (SOP20).jpg        94.76 KB
      │   │   (SOP24).jpg        100.99 KB
      │   │   (SOP28).jpg        94.57 KB
      │   │   (SOP32).JPG        0.99 MB
      │   │   (SOP8).jpg        126.44 KB
      │   └─SSOP series        (0 folders, 3 files, 762.41 KB, 762.41 KB in total.)
      │       (SSOP20).jpg        128.52 KB
      │       (SSOP24).jpg        132.81 KB
      │       (SSOP48).JPG        501.08 KB
      ├─+其他资料区        (1 folders, 1 files, 513.66 KB, 107.13 MB in total.)
      │ │ Ansys_2006Conf.rar        513.66 KB
      │ └─ansys2006papers        (0 folders, 12 files, 106.63 MB, 106.63 MB in total.)
      │     兵器工业.rar        4.61 MB
      │     船舶工业.rar        3.80 MB
      │     电子电器.rar        6.08 MB
      │     钢铁冶金.rar        5.89 MB
      │     航空航天.rar        14.77 MB
      │     核能工业.rar        6.14 MB
      │     机械制造.rar        14.72 MB
      │     其他.rar        3.49 MB
      │     汽车工业.rar        14.14 MB
      │     石化容器.rar        4.51 MB
      │     铁道工业.rar        14.48 MB
      │     土木建筑.rar        13.98 MB
      └─+软件教程区        (6 folders, 0 files, 0 bytes, 976.12 KB in total.)
        ├─ANSYS        (1 folders, 0 files, 0 bytes, 300.45 KB in total.)
        │ └─ANS11.0        (0 folders, 3 files, 300.45 KB, 300.45 KB in total.)
        │     Snap1.gif        76.91 KB
        │     Snap2.gif        118.66 KB
        │     Snap3.gif        104.88 KB
        ├─Flotherm        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
        ├─Icepak        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
        ├─Matlab        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
        ├─Moldflow        (0 folders, 1 files, 675.67 KB, 675.67 KB in total.)
        │   mficchip.rar        675.67 KB
        └─MSC        (0 folders, 0 files, 0 bytes, 0 bytes in total.)
  • heusxg (2006-12-14 14:44:43)

    具体参考地址:http://www.iccae.com/viewthread.php?tid=398&extra=page%3D1,申请加精。
  • 新同学 (2006-12-15 12:21:48)

    太强了,支持! 不过不知道是否能下到?
  • 10769394 (2007-1-22 19:11:26)

    下载不了,,,,,,无访问权!!!!!!!!!!!!
  • cobainx (2007-1-23 15:12:35)

    原来可以免费下载,无需积分,现在好象不可以了。
  • yb520315 (2007-5-13 20:32:31)

    我想下载~~~~~~~~~~~~~~~~~怎么下啊
  • danee (2007-8-01 09:22:07)

    可不可以下呀.
  • yafengding (2007-9-07 16:32:58)

    下载不了,,,,,,无访问权!!!!!!!!!!!!
  • bage0213 (2007-10-07 00:19:00)

    ytyty谢谢楼主分享
  • neal886 (2007-11-15 19:34:01)

    太强了!顶!!!不过要积分的话,这么多有用的东西,那不是要吐血!?呵呵呵
  • neal886 (2007-11-15 20:33:34)

    帖子不存在了~~
  • edithcjh (2008-5-25 21:25:37)

    可惜可惜,来的晚了,有哪位兄弟下到吗
  • jqs68 (2008-6-25 17:35:52)

    要怎么才能下载啊?