2011最新电子胶水入门教材(英文)

Adhesives Technology for
Electronic Applications:
Materials, Processing,
Reliability




This book brings together the entire technology of adhesives for electronics,
starting with an Introduction that defines the various devices and packaging
approaches; then progresses to Functions and Theory, Chemistry and Properties,
Bonding and Manufacturing Processes, Applications, Reliability, Test Procedures,
and Specifications. In addition to discussions on general applications such as die,
substrate, and lid attachments, specific applications such as those for automotive,
consumer, medical, space, and military are covered. Special treatment has been given
to relatively new developments including anisotropic adhesives, electrically
conductive adhesives as replacements for lead-bearing solders, and underfill adhesives
for flip-chip devices and ball-grid array packages. Mindful of current environment
and energy requirements, we also discuss and compare formulations and curing
methods that will meet these requirements such as UV curing, microwave curing,
moisture curing, and 100% solids’ adhesives.
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  • annyway (2012-6-04 16:52:09)

  • yixiao (2013-7-19 12:55:41)

    看不懂,来了也要支持一下嘛
  • alec1879 (2014-11-06 05:50:37)

    是一本不錯的書  來學習一下囉  感謝樓主分享